Dual-Laser Circuit Probing for Crosstalk-Free Fault Detection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As optical resolution reaches physical limitations and component density increases in semiconductor manufacturing, electro-optical crosstalk becomes problematic, reducing the viability of laser probing when feature sizes are much smaller than the optic probe spot, making it difficult to distinguish between crosstalk signals and actual errors in semiconductor components.
Innovation Solution
The use of a dual-laser system, where one laser stimulates a first circuit and another measures a target circuit downstream, allowing for the analysis of measured signals to accurately detect faults or errors by introducing a perturbation with a high intensity pulse and comparing the resulting signal changes to isolate the target circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If laser probing is used to test transistors and components, then fault detection capability is improved, but electro-optical crosstalk from neighboring components increases, reducing measurement precision
Solution Approach 1:
The patent segments the measurement process into multiple time windows, where each window captures signals from specific components sequentially. By dividing the measurement time into discrete intervals, the system can isolate and detect signals from individual components without interference from neighboring components, effectively eliminating crosstalk while maintaining fault detection capability.
Solution Approach 2:
The patent employs periodic sampling at different time windows to capture component states sequentially. This periodic measurement approach allows the system to repeatedly sample signals at optimized time intervals, separating overlapping signals from neighboring components through time-domain multiplexing and eliminating electro-optical crosstalk interference.
2Measurement precision
If optical resolution is increased to distinguish smaller features, then measurement precision improves, but the system complexity and cost increase due to advanced optical components
Solution Approach 1:
The patent replaces the mechanical/optical resolution approach with an electronic timing-based approach. Instead of using more complex optical components to achieve better resolution, the system uses precise timing control and electronic sampling to distinguish between components. This substitution of optical mechanisms with electronic timing methods achieves the same measurement precision with significantly reduced system complexity.
Solution Approach 2:
The patent changes the measurement parameter from spatial resolution (optical) to temporal resolution (time window). By transitioning from measuring components based on their physical position and optical characteristics to measuring them based on their temporal activity patterns, the system achieves high measurement precision without requiring advanced optical components, thereby reducing device complexity.
3Productivity
If component density is increased to improve productivity, then manufacturing efficiency improves, but electro-optical crosstalk increases, making fault detection more difficult
Solution Approach 1:
The patent segments the measurement process into multiple time windows, allowing the system to sequentially capture signals from densely packed components without interference. By dividing the measurement time into discrete intervals corresponding to different component activation periods, the system can accurately distinguish signals from neighboring components even in high-density layouts, maintaining measurement precision while supporting increased productivity.
Solution Approach 2:
The patent uses periodic sampling at different time windows to measure signals from components in dense arrangements. This time-domain multiplexing approach allows the system to repeatedly sample at optimized intervals, separating overlapping signals from closely spaced components through temporal isolation, thereby maintaining signal distinction capability in high-density configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the dependence on optical resolution and eliminates background crosstalk, enabling accurate fault detection and isolation in semiconductor components by separating target signals from neighboring components, even in densely packed circuits.
Implementation Method 1
stimulating, using a first laser, a first circuit of a circuit system
Implementation Method 2
Laser or electro-optic probing can test transistors and other components of a chip by focusing a laser into a component through a silicon substrate of the chip
Implementation Method 3
measuring a signal, using a second laser, from a target circuit of the circuit system that is downstream of the first circuit
Implementation Method 4
stimulating the first circuit using a high intensity pulse from the first laser to introduce a perturbation
Data Source
AI summary
The disclosed method includes waveform extractions from a cross-talking environment by measuring a signal from a target circuit/transistor while deterministically stimulating a second circuit using a second laser and post-processing. The method includes analyzing the measured signal detecting a fault or an error in one of the circuits based on the analysis. Various other methods, systems, and computer-readable media are also disclosed.