Optical TGV Scanning for Non-Destructive 3D Inspection
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Solution Overview
Problem
Current TGV inspection methods are destructive, costly, and unable to non-destructively observe the internal structure of through glass vias, leading to increased manufacturing costs and limited inspection capabilities.
Innovation Solution
An optical scanning system using an optical image processing device and scanning device to generate and convert optical beams, allowing non-destructive acquisition of three-dimensional structural images by scanning along multiple axes and reconstructing internal and external structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a cross section is obtained by cutting a glass substrate and inspected by a scanning electron microscope, then the quality of TGVs can be inspected, but the inspection method is destructive and manufacturing costs increase
Solution Approach 1:
The patent replaces the mechanical cutting process with optical scanning technology. Instead of physically sectioning the glass substrate to inspect TGVs, the system uses optical beams to scan and image the TGV structures non-destructively, eliminating the need for mechanical destruction of the sample while maintaining inspection capability
Solution Approach 2:
The patent creates optical copies or images of the TGV internal structures through optical scanning and imaging. Rather than requiring physical access to cross-sections, the system generates visual replicas of the TGV geometry and quality characteristics, enabling inspection without physical destruction
2Ease of operation
If an optical microscope is used to observe the surface structure of a TGV, then surface observation is possible, but the internal structure cannot be observed and Z-axis inspection is impossible
Solution Approach 1:
The patent transitions from two-dimensional surface observation to three-dimensional internal structure imaging. By implementing optical scanning along multiple axes (X, Y, and Z directions) and reconstructing cross-sectional images, the system reveals internal TGV structures that are invisible to conventional optical microscopes, adding the depth dimension to the inspection capability
3Measurement precision
If a scanning electron microscope is used to form an image of a TGV after cutting the glass substrate, then detailed imaging is possible, but the apparatus is extremely expensive and difficult for most manufacturers to purchase
Solution Approach 1:
The patent employs relatively inexpensive optical components and scanning technology instead of expensive electron microscopy equipment. The optical scanning system uses affordable optical beams, lenses, and detectors to achieve TGV imaging capability, making the inspection system economically accessible to most manufacturers
Solution Approach 2:
The patent replaces the complex and expensive electron microscope system with a simpler optical scanning system. By using optical instead of electron-based imaging, the system achieves comparable inspection capability at a fraction of the cost and complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables non-destructive observation of internal TGV structures, reduces inspection costs, and enhances measurement capabilities by providing detailed three-dimensional images for quality assessment.
Implementation Method 1
an optical image processing device, configured to generate an optical beam along a first axis direction; and an optical scanning device, coupled to the optical image processing device, configured to convert the optical beam along the first optical axis direction into an optical beam along a second optical axis direction, and scan an object to be inspected by the optical beam along the second optical axis direction
Data Source
AI summary
An optical scanning system for non-destructively acquiring a three-dimensional structure of an object includes an optical image processing device and an optical scanning device. The optical image processing device is configured to generate an optical beam along a first optical axis direction. The optical scanning device is configured to convert the optical beam along the first optical axis direction into an optical beam along a second optical axis direction, and scan an object to be inspected by using the optical beam along the second optical axis direction. The optical image processing device scans the object to be inspected by the optical scanning device along X-axis and Y-axis directions to acquire YZ and XZ cross section structural images at different consecutive positions, so as to reconstruct a three-dimensional structural image.