Buried Capacitor Structure with Dielectric Insulation
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Solution Overview
Problem
Conventional buried capacitor structures are susceptible to environmental factors, such as high humidity, which can reduce breakdown voltage and damage the capacitor, and have a larger distance between electrodes, limiting their performance.
Innovation Solution
A method involving a buried capacitor structure with a capacitor embedded between dielectric layers, through-holes drilled to connect electrode ends with a second metal layer, and insulating layers to protect the capacitor from environmental influences, allowing for a smaller electrode distance and improved insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the capacitor is exposed on the surface of the dielectric film, then the manufacturing process is simpler, but the capacitor is susceptible to environmental factors such as humidity which reduces breakdown voltage and damages the capacitor
Solution Approach 1:
The capacitor is nested within the multi-layer circuit board structure, specifically embedded between inner layers and enclosed by dielectric layers. This nesting approach protects the capacitor from environmental factors while maintaining a compact design, resolving the contradiction between manufacturing simplicity and reliability.
Solution Approach 2:
The capacitor structure transitions from a surface-mounted 2D configuration to a 3D embedded structure within the circuit board layers. By moving the capacitor into the third dimension (between layers), the design achieves both protection from environmental factors and space efficiency, while the lamination process maintains manufacturing feasibility.
2Stability of the object's composition
If the distance between positive and negative electrodes is increased, then the capacitor is more stable, but the capacitance decreases and the electrode separation is larger
Solution Approach 1:
The dielectric layer uses a composite material structure with high permittivity properties, allowing the capacitor to achieve both stability and high capacitance with reduced electrode separation. The composite dielectric enables compact design while maintaining electrical stability.
Solution Approach 2:
The design changes the dielectric permittivity parameter to a higher value, which allows the capacitor to maintain or increase capacitance even with smaller electrode separation distance. This parameter change resolves the contradiction between stability and capacitance quantity.
3Reliability
If the capacitor is buried between dielectric layers, then the capacitor is insulated from environmental factors, but the manufacturing process becomes more complex with additional lamination and through-hole processing
Solution Approach 1:
The through-holes serve multiple functions: they provide electrical connections to the capacitor electrodes and are filled with conductive material to create both functional and structural elements. This multi-functionality reduces the need for separate connection structures, simplifying the overall manufacturing process while achieving reliable insulation.
4Quantity of substance
If the electrode area is increased to increase capacitance, then the capacitance increases, but the space occupied on the circuit board increases
Solution Approach 1:
The capacitor design utilizes the vertical dimension between circuit board layers to increase effective electrode area without increasing the horizontal footprint on the circuit board surface. This 3D embedding approach allows high capacitance values while maintaining compact board layout.
Solution Approach 2:
The electrode structure is segmented into multiple comb-like fingers that interdigitate with opposing electrodes. This segmentation increases the effective electrode area and thus the capacitance within a compact footprint, resolving the contradiction between capacitance quantity and board space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a buried capacitor structure that is insulated from environmental factors, enhancing reliability and capacitance by reducing electrode separation, thus improving durability and performance.
Implementation Method 1
a first insulating layer and a second insulating layer are formed on the first metal layer and the second metal layer, respectively... the capacitor is insulated from environment
Implementation Method 2
filling a metal material into the positive through-hole and the negative through-hole, thereby connecting a positive electrode end and a negative electrode end of the capacitor with the second metal layer
Implementation Method 3
a parallel plate capacitor, which has a source electrode and a ground electrode divided by a dielectric layer... capacitance of the capacitor is proportional to permittivity
Data Source
AI summary
A method for fabricating a buried capacitor structure includes: laminating a first dielectric layer having a capacitor embedded therein with a second dielectric layer to bury the capacitor therebetween; forming a first circuit pattern on a first metal layer of the first dielectric layer and a second circuit pattern on a second metal layer of the second dielectric layer; depositing a first insulating layer and a second insulating layer on the first metal layer and the second metal layer, respectively; electrically connecting a positive electrode end and a negative electrode end of the capacitor to the second metal layer by a positive through-hole and a negative through-hole, thereby manufacturing the buried capacitor structure.