Lamination Ancillary Operations TRIZ Cases

Laser ablation trims dummy areas on flexible display support members, aligning end surfaces to prevent lamination errors and impact defects.

Pre-heating glass surfaces suppresses adhesive force increase during heating, allowing easy peeling after electronic device formation.

A disassembly system uses cooling to reduce adhesive strength and a separating stick to detach the window from the display panel.

A wiring substrate method uses a removable tape base to create a smooth build-up layer surface for precise fine wiring formation.

Through-holes in a carrier substrate guide a reaction solution to dissolve an adhesive layer, preventing damage or wrinkling during flexible thin film lifting.

An aviation pallet combines an expanded polystyrene core with a polyethylene terephthalate film surface to create a lightweight, solvent-resistant cargo platform.

A rolling press deforms SPC floor edges to create integrated chamfers without damaging wear-resistant layers.

Extracting material from compound laminates replaces costly chemical etching, improving production efficiency and reducing process complexity.

Photolithographic etching creates dams and retention features on electrosurgical seal plates.

Dual-component electrostatic deposition applies discrete toughening particles to resin films without mixing them into the bulk material.

An inclined carrier tape path positions the top tape removal device above the transport line to expose components without obstructing the horizontal transfer head.

Exposing the optical film-carrying glass substrate to 40-98°C and 60-99% humidity reduces adhesive strength, enabling damage-free removal without residue.

An adhering means peels polarizing film sheet pieces from release films without friction, suppressing foreign substance generation during attachment.

A transponder label employs a temperature-resistant spacer and adhesive layer to prevent shrinkage during high-temperature painting processes.

A flexible support mandrel with internal stiffening components relocates the neutral bending axis to control curvature formation.

A polymeric film assembly uses a solidified interlayer that softens upon contact with a heated substrate to enable direct surface adherence.

Segmented heaters cure adhesives between SMC roof panels, resolving incomplete bonding caused by restricted heater access in rear gusset areas.

A liquid crystal polymer film lamination method uses a patterned metal substrate to induce specific molecular orientations during thermal processing.

Matching softening points eliminates separate labeling steps and reduces production complexity.

A composite anti-glue film assembly prevents prepreg sheet overflow and eliminates residual glue issues on core plates.

A rotatable wheel uses suction to lift a liner while a synchronized pinch arm clamps the peeled portion for automated removal.

A rotary conveyance drum transfers separators via suction to reduce manufacturing time and improve positioning accuracy.

A separating apparatus uses a wedge portion to apply force across the substrate boundary.

Co-extruded polypropylene adhesion and slip layers on aluminum alloy form a lubricated metalloplastic strip, eliminating external varnish.

A graphene pinhole-blocking layer seals gas leakage pathways in radiation windows while maintaining high X-ray transmission.

A joining device applies a pre-applied adhesive film to sheet metal using thermoplastic conversion for bonding.

Simultaneous bending and polymerization of stacked plies prevents bridging defects and reduces manufacturing time.

Graphene oxide adhesive bonds polyimide-based carbon film layers, resolving size shrinkage and internal stress during carbonization.

A buried capacitor structure embeds electrodes between dielectric layers to reduce separation distance and boost capacitance density.

A trimming device moves along card edges to remove overhanging laminated overlay material.

A release layer composed of reactive polysilsesquioxane and crosslinkable siloxane enables precise substrate separation via infrared irradiation.

A composite adhesive composition combines methacrylic radical and cationic epoxy compounds to bond polarizing plates.

Shearing film-adhered sintered ceramic sheets via controlled die clearance eliminates burrs and deformation while maintaining complex shape precision.

Orientation unit rotates the base unit upstream of application stations to reduce moving mass and eliminate complex robot mechanisms.

Real-time position feedback adjusts power levels to correct horn displacement deviations, ensuring consistent weld joint quality.

A debonding device uses a deflecting element to create a deflection line in tensioned tape for peeling structures from carriers.

Sequential stretching creates micropores in laminated polyolefin, resolving the trade-off between breathability and mechanical strength.

A rectangular RFID sheet with a 45-degree beveled corner enables precise orientation during commercial digital printing processes.

A processor-controlled weight applicator system deposits prescribed zinc alloy lengths onto wheel-tire assemblies using a rotating pressure roller.

Cryogenic treatment transforms retained austenite in ultra high hardness steel to martensite, increasing elongation and toughness.

A polymer-nanoparticle-enhanced interlayer incorporates derivatized nanoparticles into the molecular backbone of thermoplastic fibers to form a composite veil.

Interleaved coating layers eliminate lamination steps, reducing manufacturing complexity while maintaining optical window durability.

Segmented expandable material fills corners and cracks without increasing thickness, reducing cost and controlling expansion.

Heating wire softens adhesive to separate touch panel from display module, preventing damage during disassembly.

A pulsed laser forms modified regions in a workpiece to enable precise division along intended lines.

A continuous manufacturing method segments polarizing film into unit areas to separate defective zones from normal sheet pieces before panel bonding.

Asymmetric band pattern placement reduces total width deviation during synchronized cutting, preventing vinyl chloride expansion defects.

A carrier substrate with a buffer layer enables simultaneous micro device transfer to a receiving substrate through temperature adjustment.

A magnesium oxide floor panel uses a high-density upper crust and reinforcing layer to enhance structural strength.