Carrier Substrate Assembly With Through-Holes For Flexible Display Lifting

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for lifting off flexible thin films from rigid carrier substrates often result in damage, wrinkles, or cracking of patterned films, such as ITO layers, due to mechanical, heating, or cooling processes, which adversely affect the performance of the flexible displays.

Innovation Solution

A carrier substrate assembly with through-holes and a layered adhesive system, where the adhesive layer's central portion reduces adhesiveness upon reacting with a solution, allowing for controlled separation of the flexible thin film from the carrier substrate without damaging the film, using a reaction solution that passes through the holes to break the adhesive bond.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If mechanical force is used to directly lift off the flexible thin film from the adhesive layer, then the lifting-off process is simple, but the flexible thin film and patterned film are easily damaged or wrinkled

Engineering Contradiction:

Improvelifting-off process simplicityVSAvoidflexible thin film integrity

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent replaces the direct mechanical lifting-off method with a chemical dissolution method. A solvent is applied to the adhesive layer, which dissolves the adhesive chemically, allowing the flexible thin film to be released without mechanical force. This substitution eliminates the damage and wrinkling caused by mechanical pulling while maintaining operational simplicity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a solvent as an intermediary substance between the flexible thin film and the adhesive layer. The solvent mediates the separation process by dissolving the adhesive, enabling the film to be released without direct mechanical interaction. This intermediary approach protects the film from damage while achieving the lifting-off goal.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If heating or cooling is used to separate the flexible thin film from the adhesive layer, then adhesion is reduced, but the flexible thin film and patterned film are still damaged or cracked

Engineering Contradiction:

Improveadhesion reductionVSAvoidpatterned film quality

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces thermal methods (heating or cooling) with a chemical dissolution method using a solvent. Instead of relying on temperature changes to reduce adhesion, the solvent chemically dissolves the adhesive layer, achieving separation without thermal stress. This prevents cracking and damage to the patterned film while maintaining effective adhesion reduction.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If a rigid carrier substrate is used with adhesive layer for non-roll-to-roll lamination, then the lamination process is effective, but the flexible thin film is difficult to lift off without damage

Engineering Contradiction:

Improvelamination effectivenessVSAvoidlifting-off difficulty

Core Design Contradiction:

Ease of manufactureVSEase of operation

Solution Approach 1:

The patent introduces a solvent as an intermediary that enables easy lifting-off from the rigid carrier substrate. The solvent is applied to dissolve the adhesive layer, converting a difficult mechanical lifting-off process into a simple chemical dissolution process. This maintains the effectiveness of the rigid carrier substrate for lamination while solving the lifting-off difficulty.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the state of the adhesive layer from bonded to dissolved by applying a solvent. This parameter change (from solid adhesive to dissolved adhesive) transforms the lifting-off process from difficult and damaging to easy and safe, while maintaining the rigid carrier substrate's lamination effectiveness.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively lifts off the flexible thin film without causing damage or wrinkles, maintaining the integrity of the patterned film, and allowing for repeated use of the carrier substrate, thus improving the efficiency and yield of flexible display fabrication.

Implementation Method 1

the adhesive layer's central portion reduces adhesiveness upon reacting with a solution

Methodology Applied

Scientific EffectChemical reaction: Chemical Bonding

Data Source

PatentEP3405345B1Carrier substrate assembly, and fabrication method of flexible display substrate

Publication Date: 2021.03.24 BOE TECHNOLOGY GROUP CO LTD

Figure 1
Figure 2A
Figure 2B~2C

AI summary

A carrier substrate assembly, and a method of using the carrier substrate assembly, for fabricating a flexible display substrate. The carrier substrate assembly comprises a carrier substrate(10), which has a central region(102) with a plurality of through-holes(11) and a peripheral region(101) surrounding the central region(102). The plurality of through-holes(10) are configured to provide passageways for a reaction solution to facilitate separation of the flexible thin film(30) laminated over an upper surface(10a) of the carrier substrate(10) from the carrier substrate(10) during the lifting-off of the flexible thin film(30).