Mechanical Wedge Separation for Composite Substrates
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Solution Overview
Problem
The existing methods for separating a composite substrate, such as in optical device fabrication, face challenges due to nonuniform breakage of the buffer layer and interference from asperities, which complicates the separation of epitaxy substrates from light emitting layers.
Innovation Solution
A separating apparatus with a support base, side surface supporting means, and a separating member with a wedge portion that can be positioned and advanced to apply a separating force across the boundary between substrates, ensuring uniform separation even with nonuniform buffer layer breakage and asperities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a laser beam is applied from the back side of the epitaxy substrate to break the buffer layer, then the buffer layer can be decomposed and the epitaxy substrate can be separated from the light emitting layer, but the break of the buffer layer becomes nonuniform due to decomposition into Ga and gas, causing difficulty in smooth separation
Solution Approach 1:
The patent replaces the laser-based thermal decomposition method with a mechanical separation method. A separating apparatus with a separating member (such as a blade or scalpel) is used to mechanically cut or separate the buffer layer from the epitaxy substrate, eliminating the nonuniform decomposition problem inherent in laser heating while achieving reliable separation.
Solution Approach 2:
The patent changes the separation mechanism from thermal (laser) to mechanical. By controlling the mechanical force applied by the separating member and adjusting parameters such as cutting speed, pressure, and angle, the buffer layer can be uniformly separated without the decomposition issues that occur with laser heating.
2Illumination intensity
If asperities are formed on the front side of the epitaxy substrate to improve luminance, then the luminance of optical devices is improved, but the laser beam may be interrupted by the wall of the asperities, suppressing the break of the buffer layer and causing difficulty in separation
Solution Approach 1:
The patent replaces the laser-based thermal decomposition method with a mechanical separation method. A separating apparatus with a separating member (such as a blade or scalpel) is used to mechanically cut or separate the buffer layer from the epitaxy substrate, eliminating the nonuniform decomposition problem inherent in laser heating while achieving reliable separation.
Solution Approach 2:
The patent applies preliminary mechanical preparation to the buffer layer before final separation. The separating member can be positioned and prepared in advance to ensure clean cutting through the buffer layer, avoiding interference from asperities that would disrupt laser beam paths.
3Ease of manufacture
If the focal point of the laser beam is set at the buffer layer to decompose gallium nitride into Ga and gas, then the buffer layer can be broken, but the decomposition is nonuniform and causes problems in smooth separation
Solution Approach 1:
The patent replaces the laser-based thermal decomposition method with a mechanical separation method. A separating apparatus with a separating member (such as a blade or scalpel) is used to mechanically cut or separate the buffer layer from the epitaxy substrate, eliminating the nonuniform decomposition problem inherent in laser heating while achieving reliable separation.
Solution Approach 2:
The patent introduces an intermediary separating member (blade, scalpel, or cutting tool) between the operator and the buffer layer. This intermediary tool provides controlled, uniform mechanical force to separate the buffer layer, avoiding the uncontrolled thermal decomposition that occurs with direct laser focusing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and efficient separation of composite substrates into individual substrates, improving the transfer process by applying a separating force at multiple positions, thus overcoming issues of nonuniform buffer layer breakage and asperity interference.
Implementation Method 1
the separating member having a wedge portion adapted to be penetrated into the boundary between the first substrate and the second substrate
Data Source
AI summary
A separating apparatus for separating a composite substrate into a first substrate and a second substrate previously bonded to each other. The separating apparatus includes a support base having a supporting surface for supporting the composite substrate, a pair of side surface supporting rollers for supporting the peripheral side surface of the composite substrate placed on the supporting surface, and a separating unit for applying a separating force to the boundary between the first substrate and the second substrate constituting the composite substrate supported to the supporting surface of the support base and the side surface supporting rollers, thereby separating the composite substrate into the first substrate and the second substrate.