Composite Anti-Glue Film for PCB Core Plate Protection
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Solution Overview
Problem
During the manufacturing of printed circuit boards (PCBs), prepreg sheets often accidentally fall or overflow onto core plates, leading to product scrap, and the use of high-temperature resistant adhesive tapes results in residual glue that affects the quality of the product.
Innovation Solution
A composite anti-glue film assembly is used, comprising a polyimide first anti-glue film layer, a second anti-glue film layer, and a bonding layer, which is laminated and bonded to prevent the prepreg sheet from falling or overflowing while avoiding glue residue on the core plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive tape is used to prevent prepreg sheet from falling to preset position, then the prepreg sheet overflow is prevented, but residual glue remains on the core plate affecting product quality
Solution Approach 1:
The adhesive layer is extracted and removed from the preset position before the prepreg sheet is placed. This allows the preset position to be clear and free of adhesive residue, preventing the harmful effect of residual glue while maintaining the protective function of the preset position
Solution Approach 2:
A disposable protective film is placed on the preset position instead of adhesive tape. This film serves its protective function during the manufacturing process and is then removed, leaving no residual glue on the core plate, thus solving the quality issue while maintaining positioning reliability
2Reliability
If adhesive tape is arranged at preset position to cover and prevent prepreg sheet falling, then product defect is reduced, but manufacturing complexity increases due to additional steps
Solution Approach 1:
A disposable protective film is used instead of adhesive tape. The film is simply placed on the preset position and removed after use, eliminating the need for complex adhesive removal processes and reducing manufacturing complexity while maintaining positioning reliability
Solution Approach 2:
The protective film is discarded after serving its protective function during the manufacturing process. This simple discard approach eliminates the need for complex adhesive removal steps, reducing manufacturing complexity while ensuring the preset position is clean for the next process step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents prepreg sheet overflow and residual glue issues, increasing the product pass rate by protecting the core plate positions and preventing medium layer contact during PCB processing.
Implementation Method 1
a composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer that are laminatingly disposed and bonded to each other
Data Source
AI summary
The present disclosure provides a printed circuit board and a manufacturing method of the printed circuit board. The manufacturing method may include: at least two core plates may be provided; a composite anti-glue film assembly may be arranged at a preset position of one of the at least two core plates, the composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer. The first anti-glue film layer may contact the preset position. The first anti-glue film layer may be a polyimide layer. The bonding layer may be configured to bond the first anti-glue film layer and the second anti-glue film layer together to produce the composite anti-glue film assembly. Two adjacent core plates may be connected through a medium layer. The core plates may be cut-out and form the printed circuit board.