Wafer Debonding Device with Deflecting Element
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In thin wafer handling technology, the high residual force required to lift structures from a carrier wafer during debonding leads to excessive stress and potential damage, as existing methods often necessitate a high overall force for debonding without effective stress reduction.
Innovation Solution
A device and method utilizing a tape laminated to the structure, with a first and second holder to maintain tension and a deflecting-element that creates a deflection-line between the holders, allowing the tape to be deflected parallel to the carrier, reducing the force needed for debonding by peeling the structure off rather than tearing it.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If structures are lifted all at once without bending during debonding, then the debonding process is simple and fast, but the overall force required is very high causing stress and potential damage
Solution Approach 1:
The debonding process is segmented into multiple sequential steps by dividing the structure into different lifting zones. The lifting element contacts different regions of the structure at different times, creating multiple debonding stages rather than lifting the entire structure simultaneously. This segmentation reduces the peak force required at any single moment while maintaining overall debonding efficiency.
Solution Approach 2:
The lifting element is designed to be movable and adaptable, allowing it to dynamically adjust its position and contact points on the structure. This dynamic capability enables the system to optimize the debonding process by applying force at optimal locations and angles, reducing the overall force requirement while maintaining productivity.
2Reliability
If high force is applied to lift structures from carrier wafer, then debonding is achieved, but stress on structures increases causing potential damage
Solution Approach 1:
The lifting element is designed with specific local properties including compliant materials and geometric features that distribute force locally across the structure's surface. This local quality optimization allows effective debonding at the contact interface while minimizing stress concentration that could damage the structure. The lifting element's local characteristics are tailored to match the structure's mechanical properties.
Solution Approach 2:
The lifting element incorporates cushioning features and compliant materials that absorb and distribute stress before it reaches the structure. This beforehand cushioning protects the structure from high peak forces during the debonding process, reducing the risk of damage while maintaining debonding effectiveness.
3Device complexity
If structures are lifted without bending, then handling is simpler, but the force required increases significantly
Solution Approach 1:
The lifting element features curved or rounded contact surfaces that naturally induce bending in the structure during debonding. This curvature allows the structure to flex and peel away from the carrier wafer in a controlled manner, reducing the force required compared to flat, rigid lifting. The spherical or curved geometry distributes stress more effectively.
Solution Approach 2:
The lifting element utilizes flexible or compliant materials that can deform and adapt to the structure's shape during debonding. This flexibility allows the element to induce controlled bending in the structure, enabling lower force debonding while maintaining handling simplicity through the compliant nature of the lifting element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the stress on the structure during debonding, optimizing the transfer process by minimizing the force applied, thereby protecting the structure and facilitating a more controlled and efficient transfer to a new destination.
Implementation Method 1
a deflecting-element for providing a deflection-line arranged between the first holder and the second holder for deflecting the tape in response to moving the second holder into the lifted position
Data Source
AI summary
A device for debonding a structure from a main surface region of a carrier includes a tape for laminating to the structure, a first holder and a second holder for spanning the tape and to keep a tension of the tape. The second holder can be movable into a lifted position vertically offset to the main surface region of the carrier. The device can also include a deflecting-element for providing a deflection-line between the first holder and the second holder for deflecting the tape in response to moving the second holder into the lifted position. The deflecting-element can be moveable parallel to the carrier for moving the deflection-line parallel to the carrier and for debonding the structure, laminated to the tape, from the carrier.