Micro Device Bulk Transfer via Buffer Layer Thermal Release
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Solution Overview
Problem
Current methods for transferring light emitting diodes (LEDs) on a carrier substrate to a receiving substrate are limited by the size of electrostatic or magnetic heads, resulting in low efficiency and inability to achieve bulk transfer, with complex processes that hinder improved efficiency.
Innovation Solution
A method involving a carrier substrate with a buffer layer and micro devices, where the receiving substrate contacts the micro devices, and by changing the temperature of at least one of the substrates, a large number of micro devices (1000 to 2000000) are simultaneously transferred from the carrier to the receiving substrate, utilizing a buffer and bonding layer to ensure accurate and efficient transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrostatic force or magnetic force is used to transfer LEDs, then LEDs can be transferred one by one, but the number of LEDs transferred is limited and efficiency is low
Solution Approach 1:
The patent merges multiple LED transfer operations into a single bulk transfer operation. By using a buffer layer that can be selectively removed or deformed, all LEDs are transferred simultaneously from the carrier substrate to the receiving substrate, eliminating the need for individual transfer operations and achieving both high productivity and large quantity transfer.
Solution Approach 2:
The patent changes the physical or chemical parameters of the buffer layer (such as temperature, stress state, or chemical composition) to control the release of LEDs. By altering these parameters, the buffer layer transitions from a state that holds LEDs to a state that releases them, enabling controlled bulk transfer of large numbers of LEDs with high efficiency.
2Quantity of substance
If electrostatic head or magnetic head is used, then LEDs can be transferred, but the size of the head limits the number of LEDs that can be transferred
Solution Approach 1:
The patent extracts the limitation of using large electrostatic or magnetic heads by replacing them with a thin buffer layer structure. The buffer layer acts as a release mechanism that can be removed or deformed to release all LEDs simultaneously, eliminating the need for large complex heads and enabling transfer of large quantities of LEDs without increasing device complexity.
3Productivity
If LEDs are picked up by static electricity or magnetic force, then transfer can be achieved, but the process is complicated and efficiency cannot be improved
Solution Approach 1:
The patent replaces the complex mechanical and electromagnetic systems (electrostatic heads, magnetic heads, pickup mechanisms) with a simple buffer layer structure that uses material property changes (thermal, stress, or chemical) to release LEDs. This substitution dramatically simplifies the transfer process while maintaining or improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables bulk transfer of micro devices with high efficiency, overcoming the limitations of conventional distance-based force transfer methods by accurately releasing and positioning a large number of micro devices on the receiving substrate.
Implementation Method 1
A temperature of at least one of the carrier substrate and the receiving substrate is changed after the micro devices contact the receiving substrate
Data Source
AI summary
A method of transferring micro devices is provided. A carrier substrate including a buffer layer and a plurality of micro devices is provided. The buffer layer is located between the carrier substrate and the micro devices. The micro devices are separated from one another and positioned on the carrier substrate through the buffer layer. A receiving substrate contacts the micro devices disposed on the carrier substrate. A temperature of at least one of the carrier substrate and the receiving substrate is changed after the micro devices contact the receiving substrate. At least a portion of the micro devices are transferred from the carrier substrate onto the receiving substrate after changing the temperature of at least one of the carrier substrate and the receiving substrate.