Buried Electronic Components in Flexible TFT Substrates
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Solution Overview
Problem
Existing flexible display devices face challenges with increased thickness, weight, and reliability issues due to rigid external circuit substrates, frame area requirements, and connection defects when using flexible substrates with rigid glass substrates, limiting the flexibility and robustness of the entire device.
Innovation Solution
A thin-film transistor forming substrate with buried electronic components and flexible substrates allows for a compact, lightweight, and robust display device by arranging ICs and other components inside the substrate, enabling all four sides to be flexible and eliminating the need for external connection substrates, thus reducing thickness and frame size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid external circuit substrates are used to mount driving circuits, then circuit functionality is achieved, but device thickness and weight increase
Solution Approach 1:
The patent merges the component substrate and circuit substrate into a single integrated flexible substrate. The driving circuits are formed directly on the flexible substrate using thin-film transistor fabrication processes, eliminating the need for separate rigid circuit substrates and their mounting structures. This integration reduces both weight and thickness while maintaining full circuit functionality.
Solution Approach 2:
The patent employs a flexible substrate as the base for both component mounting and circuit formation. By using thin-film transistor technology deposited on the flexible substrate, the circuits achieve the necessary functionality while the flexible nature of the substrate eliminates the weight and rigidity associated with traditional rigid circuit boards.
2Ease of manufacture
If flexible substrates are folded to the rear face side for connection, then connection between external circuit substrate and component substrate is achieved, but device thickness increases and frame area is required
Solution Approach 1:
The patent eliminates the separate external circuit substrate and its folding connection mechanism by integrating the driving circuits directly onto the component substrate. This merger removes the need for frame areas and folding connections, thereby reducing device thickness and simplifying the overall structure while maintaining ease of manufacture through direct formation of circuits on the flexible substrate.
3Stability of the object's composition
If rigid external circuit substrate is used, then circuit stability is achieved, but all four sides of FPD cannot be made flexible
Solution Approach 1:
The patent achieves both circuit stability and flexibility by forming driving circuits directly on the flexible substrate using thin-film transistor technology. The thin-film structure provides electrical stability and reliability, while the flexible substrate enables all four sides of the FPD to be made flexible, achieving full flexibility without compromising circuit performance.
4Ease of manufacture
If flexible substrate is clamped to rigid glass substrate, then connection is achieved, but connection defects and reliability issues occur
Solution Approach 1:
The patent eliminates the connection interface between flexible and rigid substrates by merging the circuit formation process directly onto the flexible substrate. This integration removes the clamping connection mechanism that causes defects and reliability issues, achieving both ease of manufacture through direct formation and high reliability by eliminating interfacial connection problems.
Data Source
AI summary
A thin-film transistor forming substrate includes a substrate that has flexibility or elasticity and at least one electronic component that is disposed so as to be buried inside the substrate. The electronic component is configured so as to include one or more types of an IC, a capacitor, a resistor, and an inductor.