Printed Electric Component Incorporation TRIZ Cases
- PTH Rib Reinforcement for Complete Solder Filling
Non-conductive barriers reduce heat sinking in thick PCBs, allowing molten solder to fill plated through-holes completely before freezing.
- Buried Electronic Components in Flexible TFT Substrates
A flexible thin-film transistor substrate embeds integrated circuits and passive components directly within its structure to eliminate external connection substrates.
- Fine Wiring Package Terminal Alignment via Release Film
A fine wiring package employs a release film between supports and components to prevent terminal contamination and warpage during resin sealing.
- Wiring Substrate Cavity Filling with Segmented Insulating Layers
Segmented insulating layers fill substrate cavities to prevent recesses and ensure uniform thickness for precise wiring formation.
- Direct Chip Attach Circuit Board with Segmented Interconnect Zones
Segmented interconnect zones enable direct chip attachment, reducing Z-height and costs while eliminating specialized equipment needs.
- Laminate Mount Assembly Lateral Connection
Lateral electrodes on parallel substrates connect through a thin conductive film, eliminating bulky through-holes to shrink endoscope tip size.
- Dual Wiring Board Configuration for Electro-Optical Device Connection Reliability
A dual wiring board configuration connects an electro-optical panel to external circuits using separate flexible substrates.
- LTCC T/R Assembly Using BGA for RF Isolation
LTCC transmit receive assembly uses cavity isolation and coaxial vias to eliminate expensive hermetic machining.
- Buildup Board Keepout Design for Signal Transmission
A buildup board uses adjusted keepout distances to form dedicated signal transmission channels within its multilayer structure.
- Laminated Circuit Board Through-Hole Segmentation for Bonding Reliability
A laminated circuit board uses a segmented through-hole in a plate to contain conducting material within defined zones.
- Sputtered Copper Barrier Layer Prevents CAF in PCB Through Holes
A sputtered copper layer forms a conductive barrier within PCB through holes to support electrolytic plating.
- Wiring Board Heat Intercepting Member for Thermal Isolation
A wiring board integrates a through trench and heat intercepting member to prevent high-power component heat from degrading low-power component performance.