Wiring Substrate Cavity Filling with Segmented Insulating Layers
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Solution Overview
Problem
The existing methods for manufacturing wiring substrates face challenges when the volume of the cavity accommodating an electronic component increases, leading to insufficient filling by the insulating layer, which can result in recesses and adversely affect the formation of wiring layers.
Innovation Solution
A wiring substrate design where a core with a cavity is filled with an insulating layer, and an interlayer insulating layer is stacked to cover the second surface, ensuring the interlayer insulating layer's thickness matches the combined thickness of the first and second insulating layers, allowing for even filling and improved wiring layer formation despite volume increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If the volume of the cavity accommodating the electronic component increases, then the capacity to hold the electronic component is improved, but the insulating layer cannot sufficiently fill the cavity resulting in recess formation
Solution Approach 1:
The insulating layer formation process is segmented into multiple stages: first forming an initial insulating layer to fill the cavity, then forming a second insulating layer on top to cover any recesses. This segmentation allows each layer to perform its specific function optimally - the first layer fills the cavity while the second layer ensures surface flatness for subsequent wiring layer formation.
Solution Approach 2:
The first insulating layer is formed preliminarily to fill the cavity before the second insulating layer is applied. This preliminary action ensures that the cavity is filled even when its volume is large, and any resulting recesses are then covered by the subsequent second insulating layer, preventing defects in the final structure.
2Quantity of substance
If the insulating layer does not sufficiently fill the cavity, then material usage is reduced, but recesses form that adversely affect wiring layer formation
Solution Approach 1:
The insulating structure is divided into two separate insulating layers with distinct functions. The first insulating layer uses minimal material to fill the cavity, while the second insulating layer is applied specifically to cover recesses and provide a flat surface. This segmentation avoids excessive material usage while ensuring wiring layer formation is not adversely affected.
3Manufacturing precision
If the thickness of insulating layers is increased to ensure complete filling, then cavity filling is improved, but the overall substrate thickness and complexity increase
Solution Approach 1:
Instead of uniformly increasing the thickness of a single insulating layer throughout, the patent applies different thicknesses locally: the first insulating layer is thick only where needed to fill the cavity, while the second insulating layer is applied only to cover recesses in specific areas. This local quality approach ensures complete cavity filling without unnecessarily increasing overall substrate thickness or complexity.
Data Source
AI summary
A wiring substrate includes a core, first and second wiring layers formed on opposite sides of the core, an electronic component arranged in a cavity of the core, and a first insulating layer that fills the cavity and covers the one surface of the core. The electronic component is partially buried in the first insulating layer and partially projected from the cavity and exposed from the first insulating layer. A second insulating layer covers the first insulating layer. A third insulating layer covers the core and the projected and exposed portion of the electronic component. The thickness of the third insulating layer where the first wiring layer is located is equal to the total thickness of the first insulating layer and the second insulating layer where the second wiring layer is located.