Laminated Circuit Board Through-Hole Segmentation for Bonding Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing conducting-material supplying techniques for laminated circuit boards result in excess material flowing onto the interface, decreasing isolation performance and bonding reliability, especially when convex portions of the boards face each other, leading to a thinner gap between bonding layers.
Innovation Solution
A laminated circuit board design featuring a bonding layer with through-holes in a plate that accommodates the conducting material, where the diameter of the through-holes in the plate is larger than the components filled with conducting material, preventing excess material from flowing onto the bonding layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large amount of conducting material is supplied to the through-hole of the bonding layer to ensure connection even when boards are curved or bumpy, then the bonding reliability is improved, but excess conducting material flows onto the interface of the bonding layer which decreases isolation performance and bonding reliability
Solution Approach 1:
The through-hole is segmented into two functional zones: an upper portion with a larger diameter that accommodates excess conducting material, and a lower portion with a smaller diameter that ensures proper connection. This segmentation prevents the excess material from flowing onto the bonding layer interface while maintaining adequate material for reliable bonding.
Solution Approach 2:
The plate with the through-hole acts as an intermediary structure between the bonding layer and the conducting material. The through-hole's specific diameter configuration serves as a mediator that controls the conducting material's placement, allowing it to fill the hole adequately without overflowing onto the bonding layer interface.
2Reliability
If the bonding layer is made thick enough to cancel out curve and bumpiness on board surfaces, then bonding reliability is improved, but the gap between bonding layers becomes small at convex portions which causes excess conducting material to flow onto the interface
Solution Approach 1:
The through-hole diameter is segmented into two portions: the upper portion has a larger diameter to accommodate excess conducting material, while the lower portion has a smaller diameter. This segmentation allows the conducting material to be contained within the through-hole even when the gap between bonding layers is reduced at convex portions, preventing overflow onto the bonding layer interface.
Data Source
AI summary
A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is laid between the first wiring board and the second wiring board and electrically connects the first land and the second land via a conducting material; and a plate that has a through-hole through which the first land is connected to the second land, wherein a diameter of the through-hole of the plate is larger than a diameter of a component that is made by filling the conducting material.