Laminate Mount Assembly Lateral Connection
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Solution Overview
Problem
Conventional endoscope designs face challenges in reducing the size of the tip of the insertion member to minimize patient discomfort, and existing technologies for size reduction, such as through-hole connections and flexible multilayer wiring substrates, do not offer sufficient design freedom or size reduction.
Innovation Solution
A laminate mount assembly featuring inter-member connection electrodes on end surfaces of parallel substrates connected by a thin conductive film, allowing for precise positioning and reduced thickness, enabling size reduction and increased design freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are provided in middle substrate and protruding electrodes are inserted to connect substrates, then substrates can be connected, but the assembly size and complexity increase
Solution Approach 1:
The invention extracts the connection function from the substrate thickness direction (through-holes) and relocates it to the lateral surface direction. By providing connection electrodes on the lateral surfaces of substrates and connecting them with conductive films, the through-holes are eliminated, thereby reducing assembly size while maintaining connection reliability
Solution Approach 2:
The invention changes the dimension of connection from vertical (through-holes penetrating substrate thickness) to lateral (electrodes on side surfaces connected by conductive films). This dimensional transformation eliminates the need for deep through-holes and reduces overall assembly volume while achieving reliable electrical connection
2Reliability
If flexible multilayer wiring substrates are used to connect semiconductor devices, then connection is achieved, but design freedom is limited
Solution Approach 1:
The invention segments the connection structure into independent components: connection electrodes on substrates, separate conductive films for interconnection, and flexible positioning of these elements. This segmentation allows independent optimization of each component and provides greater design freedom compared to rigid multilayer substrates
Solution Approach 2:
The invention introduces flexibility and adaptability by allowing conductive films to be positioned and configured dynamically according to design requirements, rather than being constrained by fixed multilayer substrate structures. This enables versatile routing and connection configurations
3Reliability
If conventional connection methods are used, then electrical connection is achieved, but the tip length of insertion member cannot be reduced
Solution Approach 1:
The invention extracts the electrical connection function from the substrate thickness direction (eliminating through-holes) and relocates it to lateral surfaces with conductive films, thereby shortening the required insertion member tip length while maintaining reliable electrical connection
Solution Approach 2:
The invention uses thin conductive films to replace thick through-hole connections, achieving electrical connection with minimal thickness and enabling reduction of insertion member tip length
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate mount assembly achieves size reduction and enhanced design flexibility by using a thin conductive film to connect inter-member electrodes, improving the electrical performance and reducing the overall size of the assembly.
Implementation Method 1
a conductive film that electrically connects the inter-member connection electrodes to each other
Data Source
AI summary
A laminate mount assembly includes a first member that includes an inter-member connection electrode that is provided on an end surface that forms a predetermined inter-member connection side surface; a second member that includes an inter-member connection electrode that is provided on an end surface that forms the inter-member connection side surface, the second member being arranged to be parallel with the first member; and a conductive film that electrically connects the inter-member connection electrodes to each other over a portion in which the first member and the second member are opposite to each other.