Buried Gate Structure With FD-SOI Isolation for BCAT Coupling Control

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Solution Overview

Problem

As integrated circuit devices with buried channel array transistors (BCATs) experience increased integration and reduced design rules, the narrow line widths of buried word lines lead to electrical coupling and disturbance phenomena, complicating the formation and uniformity of buried channel transistors.

Innovation Solution

The implementation of a fully depleted silicon on insulator (FD-SOI) structure isolates the gate structure from the substrate, and a semiconductor channel structure layer is formed on each buried word line to reduce electrical coupling and enhance reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the degree of integration is increased and design rules are reduced, then the integration density is improved, but the line widths of buried word lines become narrower causing electrical coupling and disturbance phenomena

Engineering Contradiction:
Improveintegration densityVSAvoidelectrical performance stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent divides the continuous substrate into isolated regions by introducing element isolation films between adjacent buried word lines. This segmentation prevents electrical coupling between neighboring word lines, allowing narrow line widths to be used without causing disturbance phenomena, thus enabling high integration while maintaining electrical performance stability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The element isolation film acts as an intermediary insulating layer positioned between adjacent buried word lines. This intermediate structure blocks electrical field coupling and current leakage between neighboring word lines, resolving the electrical coupling issue that arises from reduced line widths in high-density integration.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If the line widths of buried word lines are reduced, then the integration capacity is improved, but the formation and uniformity of buried channel transistors become more difficult

Engineering Contradiction:
Improveintegration capacityVSAvoidtransistor formation uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

By segmenting the substrate with element isolation films, each buried word line operates as an independent transistor unit with well-defined boundaries. This segmentation simplifies the formation process and improves uniformity, as the isolation films provide clear lateral confinement for the channel region, making it easier to achieve consistent transistor characteristics even with narrow line widths.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The element isolation films create locally distinct regions with different electrical properties - insulating regions between word lines and active conducting regions within each transistor. This local differentiation of electrical characteristics enables precise control over current flow and transistor formation, improving manufacturing precision for narrow-line-width devices.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in high integration, high reliability, and improved electrical performance by blocking electron and hole movement with the outer insulating layer, reducing disturbance phenomena and ensuring uniform electrical characteristics.

Implementation Method 1

an outer insulating layer conformed along an inner wall of the gate trench... blocking electron and hole movement with the outer insulating layer

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Data Source

PatentEP4383979A1Integrated circuit device and method of manufacturing the same
Publication Date: 2024.06.12 SAMSUNG ELECTRONICS CO LTD
  • EP4383979A1 patent drawingFigure 1
  • EP4383979A1 patent drawingFigure 2
  • EP4383979A1 patent drawingFigure 3

AI summary

An integrated circuit device includes a substrate including an element isolation film defining an active area, and a gate structure buried in the active area of the substrate. The gate structure includes a gate trench, an outer insulating layer conformed along an inner wall of the gate trench, a channel structure layer conformed on the outer insulating layer, a gate insulating layer conformed on the channel structure layer, a gate electrode layer filling a lower area of the gate trench, and a capping insulating layer on the gate electrode layer, the capping insulating layer filling an upper area of the gate trench.