Buried Heat Pipe in Substrate for High-Power Drive Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current heat dissipation designs for high-power medium-voltage drives, such as those using aluminum extrusion heat sinks, are inefficient, leading to increased temperatures, non-compact layouts, and high costs due to large size and weight, which complicates electrical connections and increases installation costs.
Innovation Solution
A heat sink device incorporating a heat dissipation substrate with a buried evaporation section of a heat pipe and a condensation section that dissipates heat to air, with power elements placed on both sides of the substrate, utilizing copper, aluminum, or aluminum alloys, and optionally featuring heat sink fins and varying pipe dimensions and structures for enhanced thermal conductivity and reduced volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum extrusion heat sink is used for heat dissipation, then heat dissipation function is provided, but the heat sink has large volume, heavy weight and high cost
Solution Approach 1:
The heat pipe is embedded within the heat dissipation substrate, with the evaporation section buried in the inner layer and the condensation section extending to the outer surface. This nested structure allows the heat pipe to be integrated into the substrate, reducing overall volume while maintaining effective heat dissipation functionality.
Solution Approach 2:
The heat pipe utilizes phase transition of working fluid (evaporation and condensation) to transfer heat from the power elements through the substrate to the external environment. The evaporation section absorbs heat through phase change, and the condensation section releases heat, providing efficient heat dissipation in a compact form.
2Temperature
If aluminum extrusion heat sink is used, then heat dissipation is achieved, but the structure is non-compact and layout space is increased
Solution Approach 1:
Power elements are disposed on both the first surface and the second surface of the heat dissipation substrate, utilizing three-dimensional space more effectively. This bidirectional arrangement allows compact layout while maintaining adequate heat dissipation capacity, as heat can be dissipated from both surfaces of the substrate.
Solution Approach 2:
The heat pipe is nested within the substrate structure, with its evaporation section buried in the inner layer. This integration eliminates the need for separate external heat pipe components, reducing overall layout space while maintaining heat dissipation efficiency.
3Temperature
If large heat sink is used to dissipate heat, then heat dissipation requirement is met, but electrical connections and matching between power elements and electrolytic capacitor assemblies become inconvenient
Solution Approach 1:
By disposing power elements on both surfaces of the substrate, the invention creates a compact three-dimensional layout that reduces the spatial distance between power elements and electrolytic capacitor assemblies. This improves accessibility for electrical connections while maintaining effective heat dissipation from both surfaces.
Solution Approach 2:
The invention changes the structural parameters of the heat dissipation system by embedding the heat pipe within the substrate and utilizing both surfaces for component mounting. This compact configuration reduces the overall footprint and improves the convenience of electrical connections without compromising heat dissipation effectiveness.
4Temperature
If aluminum extrusion heat sink with large volume is used, then heat dissipation is provided, but weight increases and installation cost increases
Solution Approach 1:
The heat pipe is nested within the heat dissipation substrate, eliminating the need for a large external heat sink structure. This integrated nested design reduces the overall volume and weight of the heat dissipation system while maintaining effective heat dissipation through the embedded heat pipe mechanism.
Solution Approach 2:
The heat pipe utilizes phase transition of working fluid to achieve efficient heat transfer in a compact form factor. The evaporation and condensation process within the heat pipe provides high heat dissipation performance without requiring the large volume and weight associated with traditional aluminum extrusion heat sinks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces working temperatures of power elements, minimizes layout space, and decreases the overall volume of the heat dissipation substrate, while maintaining effective heat transfer and reducing system installation costs.
Implementation Method 1
The heat pipe has an evaporation section and a condensation section. The evaporation section of the heat pipe is buried in the inner layer of the heat dissipation substrate
Implementation Method 2
The heat pipe has an evaporation section and a condensation section
Implementation Method 3
the condensation section of the heat pipe is used to dissipate heat from the evaporation section to air
Implementation Method 4
the condensation section of the heat pipe is used to dissipate heat from the evaporation section to air
Data Source
AI summary
The present invention provides a heat sink device, suitable to the heat dissipation of a high-power medium-voltage drive power cell. The device comprises a heat dissipation substrate having a first surface, a second surface and an inner layer between the first surface and the second surface; a heat pipe having an evaporation section and a condensation section. The evaporation section is buried in the inner layer of the heat dissipation substrate, and the condensation section is used to dissipate the heat from the evaporation section to the air. The power elements of the high-power medium-voltage drive power cell are disposed on the first surface and the second surface, respectively.