Conversion Constructional Details TRIZ Cases

A vehicle power converter thermally connects a busbar arrangement to a cooling structure using heat-conducting means.

Optimized spatial arrangement of six power transistor units reduces parasitic inductance, resolving voltage spikes and improving efficiency.

Curved openings in extending portions enable direct fastener locking, eliminating clip-induced tilting and improving structural stability.

Stacking capacitor portions adjacent to switching elements reduces inductance, suppressing overvoltage and noise without slowing switching speed.

Terminal plates connect transistors on stacked boards, reducing inductance and conversion loss from long wires.

Vertically stacked power converter uses a flat interposer and recessed leadframe to connect chips without bonding wires, eliminating parasitic inductance.

A silicon carbide vertical MOSFET uses a double trench structure to increase channel area and reduce on-resistance.

A voltage conversion apparatus aligns magnetic field directions in loop circuits to reduce noise generated by switching operations.

Radial bus bar sectors integrate cooling fins to dissipate heat, reducing parasitic inductance and switching losses in compact power modules.

Segmented circuit units enable pre-inspection and selective mounting, resolving yield losses from direct transistor placement.

Segmented bus bar arrangement minimizes short-circuit current forces through asymmetric conductor spacing and spacer cushioning.

A phase module uses a non-detachable connection between the switching element and heat sink to enable efficient thermal conduction.

Protruding terminal arrangements shorten wire lengths in parallel power modules, reducing circuit inductance and preventing current imbalance.

Conductive films on insulating film interiors contact plate conductors to cover vacant spaces, suppressing partial discharges without increasing inductance.

A power module uses overlapping conductor projections and interlaced switches to reduce parasitic inductance.

A semiconductor device uses a metal component fixed to a case with an exposed region bonded directly to a base plate.

A power converter secures creepage distance through an insulating member with a protrusion overlapping conductor inclined surfaces.

Stacking a transformer over a semiconductor device routes alternating current vertically, preventing noise induction in direct-current wires.

A power module uses a busbar to connect output terminals at opposite casing ends for flexible electrical routing.

Segmented control boards sandwiched on a cooler reduce wiring inductance and switching losses.

Relocating the sensor to the output terminal eliminates magnetic field interference from conductive plates, ensuring precise current measurement.

A miniaturized voltage-transforming device integrates parallel circuit boards with a transformer using multi-directional pins.

A semiconductor module shares internal control terminals across multiple chips to minimize external pin count.

A conductive base plate connects to the enclosure ground to block electromagnetic noise from reaching sensitive control circuits.

Insulation covers clamp a gate driving circuit substrate to eliminate complex wiring structures and reduce manufacturing costs.

Segmenting direct and indirect cooling zones dissipates heat while preserving electrical isolation and reducing thermal expansion damage.

Surrounding coolant flow paths cool semiconductor modules and auxiliary components, resolving heat concentration in high-temperature vehicle environments.

Strategic placement of clamping components near switch chips reduces parasitic inductances, lowering instantaneous voltage spikes and switching losses.

Positioning the bonding agent on the substrate side face preserves the effective circuit area while ensuring electrical insulation and moisture resistance.

Carrier elements with embedded certification data enable automatic component matching, eliminating manual verification errors during wind turbine maintenance.

Single-side terminal arrangement eliminates complex trace routing while maintaining inverse magnetic coupling.

Perpendicular sensor orientation rejects electric reactor leakage fields, eliminating shielding costs.