Side-Face Bonding for Semiconductor Power Modules
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Solution Overview
Problem
Existing power modules face a reduction in effective circuit area due to the use of a bonding agent on the upper surface of the base plate, which compromises electrical insulation and can lead to moisture ingress and deterioration of the insulating layer.
Innovation Solution
Connecting the base plate and case with a bonding agent on the side face of the substrate, ensuring secure bonding without gaps and maintaining the effective area of the circuit pattern, using a thermoplastic resin that changes shape with heat to fit between the base plate and case for firm securing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the base plate and case are joined together with a bonding agent on the upper surface of the base plate, then electrical insulation is ensured, but the effective area of the circuit substrate on the base plate is reduced
Solution Approach 1:
The bonding agent is applied on the side face of the base plate instead of the upper surface, changing the spatial dimension of application from horizontal (upper surface) to vertical (side face). This dimensional shift allows the bonding agent to perform its sealing function without occupying any area on the circuit substrate's effective region.
2Reliability
If the base plate and case are joined together with a bonding agent, then electrical insulation is ensured, but moisture-related deterioration of the insulating layer may occur
Solution Approach 1:
The bonding agent serves as an intermediary sealing material that fills gaps between the base plate and case. By positioning it on the side face, it creates a moisture barrier that prevents water from reaching the insulating layer, thus protecting against moisture-related deterioration while maintaining electrical insulation.
3Strength
If a bonding agent is used to join the base plate and case, then secure bonding is achieved, but the effective circuit area is reduced
Solution Approach 1:
The bonding agent is positioned on the side face of the base plate rather than the upper surface, utilizing the vertical dimension for bonding. This allows the bonding function to be achieved without encroaching on the horizontal effective area of the circuit substrate, thereby maintaining both bonding strength and effective circuit area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures electrical insulation while preventing a reduction in the effective circuit area and minimizes moisture-related deterioration of the insulating layer, maintaining the integrity of the power module's performance at high temperatures.
Implementation Method 1
using a thermoplastic resin that changes shape with heat to fit between the base plate and case for firm securing
Implementation Method 2
a bonding agent bonding the case and the metal plate on a side face of the substrate
Implementation Method 3
a sealing material sealing the semiconductor device and the substrate in a section surrounded by the case
Data Source
AI summary
A semiconductor apparatus includes: a substrate including a circuit pattern on an upper surface side and a metal plate on a lower surface side; a semiconductor device joined to the circuit pattern via a conductive component; a case located to surround the substrate; a sealing material sealing the semiconductor device and the substrate in a section surrounded by the case; and a bonding agent bonding the case and the metal plate on a side face of the substrate.