Radial Bus Bar Casing for Power Device Thermal Management
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Solution Overview
Problem
Current electronic power devices face challenges in achieving compactness while maintaining thermal balance and reliability due to the need for effective heat dissipation and voltage resistance, particularly with increased switching frequencies and parasitic inductances, which hinder compact design and increase switching losses.
Innovation Solution
A modular design of bus bars forming a casing and heat dissipator with copper or aluminum bus bar sectors, featuring cooling fins, 'press pack' technology for electrical contacts, and embedded electronic components, optimized for compactness and thermal management using laminated closing plates with dielectric and conductive layers for improved electromagnetic compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If increased switching frequencies are used to improve compactness, then switching losses and parasitic inductances increase, but device performance deteriorates
Solution Approach 1:
The bus bar structure is segmented into multiple sectors arranged radially around a central axis, with each sector containing separate conductive paths for different phases. This segmentation allows current to be distributed through multiple parallel paths, reducing parasitic inductance and enabling higher switching frequencies without excessive energy loss.
Solution Approach 2:
The invention transitions from conventional planar bus bar arrangements to a three-dimensional radial configuration where bus bar sectors are stacked and arranged around a central axis. This dimensional change creates multiple thermal pathways and electrical paths simultaneously, improving both heat dissipation and electrical performance while maintaining compactness.
2Temperature
If cooling fins are added to bus bars to improve heat dissipation, then device compactness is reduced, but thermal management capability improves
Solution Approach 1:
The cooling fins are integrated directly into the bus bar structure itself, merging the electrical conductor function with the thermal dissipation function. The bus bar sectors serve dual purposes as both current carriers and heat sinks, eliminating the need for separate cooling components and maintaining compactness.
Solution Approach 2:
The bus bar sectors are designed to perform multiple functions simultaneously: electrical conduction, structural support, and thermal management. The same components that carry current also serve as heat dissipation elements through integrated cooling fins, maximizing space utilization.
3Reliability
If press pack technology is used to eliminate welding for improved reliability, then assembly complexity increases, but device reliability improves
Solution Approach 1:
The invention replaces the welding process (thermal-chemical joining) with a mechanical press pack system using clamping plates and fasteners. This substitution eliminates the complexity of welding procedures, equipment, and quality control while improving reliability by avoiding heat-affected zones and weld defects.
Solution Approach 2:
The press pack assembly uses color-coded or marked contact surfaces and alignment features to ensure proper assembly orientation and electrical contact. Visual indicators guide the assembly process, reducing complexity through intuitive alignment rather than complex mechanical fixtures.
4Reliability
If voltage resistance is increased to ensure safety, then distances between components must be increased, but device compactness is reduced
Solution Approach 1:
The bus bar sectors are nested radially around a central axis with alternating phases arranged in a compact circular pattern. This nesting allows high-voltage components to be positioned close together while maintaining adequate creepage and clearance distances through the radial geometry, achieving both compactness and voltage resistance.
Solution Approach 2:
The radial and circular geometry of the bus bar arrangement provides natural electrical insulation paths and increases surface distances between opposite-phase conductors compared to linear arrangements. The curved, multi-dimensional layout optimizes voltage resistance while minimizing the enclosed volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a more compact and reliable electronic power device design that effectively manages heat dissipation and electromagnetic radiation, enhancing switching speed and reducing parasitic inductances, thus improving the overall thermal balance and reliability of power devices.
Implementation Method 1
the external bus bar portions of the plurality of bus bar sectors comprise cooling fins on an external face
Implementation Method 2
the external bus bar portions of the plurality of bus bar sectors comprise cooling fins on an external face
Implementation Method 3
laminated closing plates with dielectric and conductive layers for improved electromagnetic compatibility
Implementation Method 4
bus bar portions comprising a plurality of electrical contact faces of the so-called 'press pack' type
Data Source
AI summary
The assembly of bus bars according to the invention comprises a plurality of sectors of bus bars (S1 to S6) which are arranged, in a connected manner and with electrical contact, around a central axis (C) and upper and lower closing plates (BPD) which are perpendicular to the central axis, the sectors of bus bars each comprising an external portion of bus bar (B11 to B16) and at least one internal portion of bus bar (B21 to B26, B31 to B36) which delimit a plurality of internal volumes, the upper and lower closing plates being in contact against upper and lower faces of the portions of bus bar, respectively, and the portions of bus bar comprising a plurality of electrical contact faces of the type referred to as “press pack”.