Semiconductor Module Terminal Merging for Temperature Detection
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Solution Overview
Problem
Conventional semiconductor modules with temperature detecting elements have a large number of external terminals, leading to a bulky device size due to the need for multiple terminals for each diode, which complicates the layout and increases the size of the power conversion device.
Innovation Solution
A semiconductor module design that connects multiple switching semiconductor chips in parallel, sharing common control terminals and reducing the number of external terminals by connecting internal terminals of each chip to those of adjacent chips, thereby minimizing the number of external terminals required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple external terminals are provided for each temperature detecting element, then temperature detection capability is improved, but device size increases
Solution Approach 1:
The patent merges multiple external terminals by connecting internal terminals of adjacent semiconductor chips together. Specifically, the first external terminal of one chip is connected to the first internal terminal, and the second external terminal is shared across multiple chips by connecting second internal terminals of adjacent chips. This merging approach maintains temperature detection capability while reducing the total number of external terminals required, thereby decreasing device size.
2Measurement precision
If four external terminals are provided for two diodes, then temperature detection accuracy is improved, but the number of external terminals increases
Solution Approach 1:
The patent makes external terminals universal by enabling the second external terminal to serve multiple chips simultaneously. The second internal terminal of each chip is connected to the common second external terminal, allowing this single terminal to function for temperature detection across multiple semiconductor chips. This multi-functionality reduces the quantity of external terminals from four (for two diodes) to three, while maintaining detection accuracy.
3Reliability
If multiple external terminals are used for each semiconductor chip, then individual chip monitoring is improved, but layout complexity increases
Solution Approach 1:
The patent segments the terminal connection strategy by treating the first and second external terminals differently. The first external terminal is dedicated to each chip's first internal terminal, preserving individual monitoring capability. The second external terminal is shared across chips through connection of second internal terminals, simplifying the overall layout. This segmented approach maintains reliability while reducing layout complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the overall size of the semiconductor module by minimizing the number of external terminals, improving layout efficiency and reducing the device size while maintaining effective temperature detection and control capabilities.
Implementation Method 1
a temperature detecting element connected between the first and second internal terminals and having a resistance value changing according to temperature of the switching element
Data Source
AI summary
In a semiconductor module, first and second semiconductor chips each include a transistor and a temperature-detecting diode connected between first and second control pads. The first control pad of the first semiconductor chip is connected to a first control terminal, the second control pad of the first semiconductor chip and the first control pad of the second semiconductor chip are connected to a second control terminal, and the second control pad of the second semiconductor chip is connected to a third control terminal.