Semiconductor Package Cooling via Encapsulated Switches

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Solution Overview

Problem

Semiconductor devices face challenges in effectively dissipating heat generated during operation, which can lead to damage from thermal expansion and contraction, and existing cooling methods may interfere with electrical performance.

Innovation Solution

The implementation of direct-cooling and indirect-cooling techniques in semiconductor devices, where switches and conductive elements are surrounded by or positioned relative to cooling materials or elements, including fluid-cooling configurations, to efficiently remove heat while maintaining electrical isolation and performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cooling materials are used to dissipate heat from semiconductor switches, then heat dissipation efficiency is improved, but electrical performance may be compromised

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidelectrical performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent divides the cooling system into separate regions: direct-cooling zones where cooling material contacts switches for efficient heat removal, and indirect-cooling zones where conductive elements are isolated from cooling material to maintain electrical performance. This segmentation allows different cooling strategies to be applied to different components based on their thermal and electrical requirements.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies different cooling approaches to different parts of the semiconductor device. Switches that generate high heat are provided with direct cooling material contact, while conductive elements are cooled indirectly or not at all to preserve their electrical properties. This localized quality optimization ensures each component receives appropriate cooling without compromising overall device performance.

Inventive Principle:

Principle #3Local quality

2Temperature

If direct-cooling techniques are used where switches are surrounded by cooling material, then heat removal efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveheat removal efficiencyVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines direct-cooling and indirect-cooling techniques into a single integrated device structure. The cooling material serves dual purposes: providing direct cooling to switches while also enabling indirect cooling to conductive elements through thermal conduction. This merging approach achieves efficient heat removal across multiple components without proportionally increasing device complexity.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If cooling elements are positioned between switches and conductive elements, then heat dissipation is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improveheat dissipationVSAvoidpositioning precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent uses cooling material as an intermediary substance between switches and conductive elements. Rather than requiring precise mechanical positioning of separate cooling components, the cooling material fills spaces and makes thermal contact with multiple components simultaneously. This intermediary approach simplifies manufacturing by reducing the need for high-precision positioning while maintaining effective heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces thermal expansion and contraction, preventing damage and improving device performance by efficiently dissipating heat without compromising electrical performance or increasing stray inductance and impedance.

Implementation Method 1

Heat dissipation techniques may utilize materials with good thermal conductivity (e.g., metals) that are designed to conduct heat away from the areas that generate heat

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

In some examples, a cooling element is configured to carry liquid in order to improve thermal dissipation of heat from the switches

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10373890B1Cooling techniques for semiconductor package

Publication Date: 2019.08.06 INFINEON TECHNOLOGIES AG

AI summary

In some examples, a device includes a high-side switch, a first high-side conductive element electrically connected to a first load terminal of the high-side switch, and a second high-side conductive element electrically connected to a second load terminal of the high-side switch. The device also includes a layer of cooling material encapsulating the high-side switch, the first high-side conductive element, and the second high-side conductive element. The device further includes a low-side switch, a first low-side conductive element electrically connected to a first load terminal of the low-side switch, and a second low-side conductive element electrically connected to a second load terminal of the low-side switch. The layer of cooling material encapsulates the low-side switch, the first low-side conductive element, and the second low-side conductive element.