Semiconductor Device Terminal Protrusion for Inductance Reduction
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Solution Overview
Problem
In power conversion devices for electric vehicles, the increased circuit inductance and size due to longer wire lengths between semiconductor devices connected in parallel lead to mismatched switching speeds and inductances, causing current imbalances and potential device destruction.
Innovation Solution
The semiconductor device configuration includes heat dissipation plates aligned on the same plane with metal terminals arranged to minimize wire length between adjacent devices, using a specific protruding portion arrangement to shorten the distance between terminals and reduce circuit inductance, thereby maintaining balanced current flow and preventing device destruction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple semiconductor devices are connected in parallel to increase power conversion device output, then the power conversion capability is improved, but the wire length between devices increases, causing circuit inductance to increase
Solution Approach 1:
The patent combines multiple semiconductor devices into a single integrated module with shared terminals and common wire connections. By merging the devices and their terminals into one unified structure, the wire length between devices is eliminated, thereby reducing circuit inductance while maintaining the parallel connection capability for increased power output.
Solution Approach 2:
The patent arranges semiconductor devices and terminals in a three-dimensional integrated structure within a single module. By utilizing vertical stacking and internal routing, the connections that would traditionally require long horizontal wire runs are shortened through spatial reorganization, reducing inductance while preserving parallel power handling capability.
2Power
If multiple semiconductor devices are connected in parallel, then the power output is improved, but the circuit inductance increases due to longer wire lengths, causing current imbalance
Solution Approach 1:
The patent merges multiple semiconductor devices into a single integrated module with shared terminals, eliminating the external wire connections that cause inductance differences. This ensures that all parallel-connected devices have identical and minimal loop inductance, preventing current imbalance and improving reliability.
Solution Approach 2:
The patent creates equipotential connections by using common terminals and minimized wire lengths for all parallel-connected semiconductor devices. This ensures that all devices experience identical electrical conditions and inductance values, preventing current distribution imbalances and enhancing system reliability.
3Length of stationary object
If the wire length between semiconductor devices is reduced, then the circuit inductance is reduced, but the device complexity increases due to integrated terminal arrangement
Solution Approach 1:
The patent combines multiple terminals from different semiconductor devices into shared common terminals within the integrated module. This merging approach reduces the total number of wire connections required while minimizing wire length, and the terminal arrangement complexity is managed through systematic design of the integrated structure.
4Power
If semiconductor devices are arranged with aligned main terminals in the same direction, then the power conversion capability is improved, but the distance between adjacent devices increases, lengthening wire length
Solution Approach 1:
The patent merges multiple semiconductor devices into a single integrated module where the devices are positioned adjacent to each other with shared terminals. This eliminates the need for long external wire connections between separately mounted devices, reducing the distance between devices while maintaining the power conversion capability through parallel connection of multiple devices within the module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces circuit inductance and device size, ensuring balanced current flow and improved reliability by minimizing the risk of device destruction due to current imbalances.
Implementation Method 1
a metal plate having heat dissipation property
Data Source
AI summary
A semiconductor device includes a plurality of arms each including: a heat dissipation plate; a switching element; a metal terminal; and a sealing material, the metal terminals of the two specific arms adjacent to each other in the first direction has a first protruding portion which protrudes from a portion of the sealing material on one side in the second direction, the first protruding portion of one specific arm is arranged on a side closer to the other specific arm than a center portion in the first direction is, at the portion of the sealing material on the one side in the second direction, and the first protruding portion of the other specific arm is arranged on a side closer to the one specific arm than a center portion in the first direction is, at the portion of the sealing material on the one side in the second direction.