Rectangular Power Converter with Surrounding Coolant Flow Paths
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Solution Overview
Problem
Existing power converter devices face challenges in efficiently cooling both the power module and other components within the device, leading to potential heat concentration and reduced performance, especially in high-temperature environments like those found in vehicles.
Innovation Solution
A 3-phase inverter circuit power converter device design featuring first, second, and third semiconductor modules arranged in a rectangular prism-shaped cabinet with coolant flow paths surrounding the components, ensuring even heat dissipation and incorporating bus bars, capacitors, and current sensors to manage heat and improve productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If coolant flow paths are provided only for semiconductor modules, then semiconductor module cooling is improved, but other electric equipment cannot be cooled efficiently
Solution Approach 1:
The coolant flow path is designed to serve multiple functions by providing cooling for both semiconductor modules and other electric equipment (bus bars, capacitors, current sensors) through a unified cooling system with multiple branches, allowing the same coolant flow path structure to cool different types of equipment simultaneously
2Temperature
If multiple separate cooling systems are provided for different equipment, then each equipment can be cooled optimally, but device complexity increases
Solution Approach 1:
Multiple cooling functions are merged into a single integrated coolant flow path system. The cooling system combines semiconductor module cooling channels with additional branches for bus bars, capacitors, and current sensors, all connected through a unified coolant circulation structure, reducing the number of separate cooling systems needed
3Adaptability or versatility
If coolant flow paths are extended to cool more components, then cooling coverage is improved, but heat dissipation uniformity may deteriorate
Solution Approach 1:
The coolant flow path is designed with local optimization, where the first flow path is positioned to cool the semiconductor module at a specific location (area interposed by other modules), while second and third flow paths cool other equipment at different locations. This localized cooling approach ensures each component receives appropriate cooling based on its specific heat generation characteristics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively cools both the power module and other components, reduces heat concentration, improves productivity, and enhances the reliability of the power converter device by ensuring uniform heat distribution and efficient heat management.
Implementation Method 1
a coolant flow path formed to surround the electric equipment containing space... a coolant supplied from the coolant flow inlet is configured to flow in an order of the second flow path, the first flow path, and the third flow path
Data Source
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AI summary
A power converter device includes first, second, and third semiconductor modules respectively provided for three phases of a 3 phase inverter circuit, and incorporating upper and lower arms series circuit, and a flow path forming cabinet in a rectangular prism shape having an electric equipment containing space and a coolant flow path formed to surround the electric equipment containing space, the coolant flow path includes a first flow path provided along a first side face of the flow path forming cabinet, a second flow path provided along a second side face contiguous to one side of the first side face and connected to one end of the first flow path, and a third flow path provided along a third side face contiguous to other side of the first side face and connected to other end of the first flow path, the first semiconductor module is arranged at the first flow path in parallel with the first side face, the second semiconductor module is arranged at the second flow path in parallel with the second side face, and the third semiconductor module is arranged at the third flow path in parallel with the third side face.