Semiconductor Module Circuit Units Segmentation for Yield Improvement
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Solution Overview
Problem
The yield rate of semiconductor modules decreases due to malfunctions during the mounting of transistors and diodes directly on a circuit board, requiring re-mounting and increasing defects.
Innovation Solution
A semiconductor module design where circuit units, including vertical type transistors and diodes, are pre-inspected as units before mounting on a circuit board, with a conductive plate connecting them to improve yield by allowing defective units to be removed and non-defective ones to be mounted, enhancing alignment and reducing surge voltage through a surge voltage absorption device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transistors and diodes are mounted directly on a circuit board, then the module can be assembled, but the yield rate decreases due to malfunctions during mounting requiring re-mounting
Solution Approach 1:
The invention segments the circuit board into multiple insulating substrates, each carrying specific circuit elements (transistors, diodes, resistors, capacitors) mounted in advance. These substrates are then assembled together to form the complete module. This segmentation allows for pre-inspection and pre-assembly of individual substrates, improving yield rate by enabling replacement of defective substrates without re-mounting all components.
Solution Approach 2:
The invention implements preliminary action by mounting and inspecting circuit elements on insulating substrates before final module assembly. The substrates are prepared in advance with their respective components, allowing defects to be detected and corrected prior to integration into the complete module, thereby improving yield rate and reducing re-mounting requirements.
2Reliability
If multiple transistors and diodes are mounted on a single circuit board, then the module can function, but alignment becomes difficult and surge voltage increases
Solution Approach 1:
The invention divides the circuit into multiple insulating substrates, each handling specific circuit functions. This segmentation simplifies alignment by confining multiple components to smaller, manageable substrate areas rather than distributing them across a large single circuit board, thereby reducing alignment difficulty while maintaining module reliability.
Solution Approach 2:
The invention introduces connection portions as intermediaries that electrically connect the multiple insulating substrates together. These connection portions facilitate reliable electrical connectivity between substrates while managing the complexity of inter-substrate connections, thereby maintaining module reliability without requiring direct complex alignment of all components on a single board.
3Productivity
If circuit elements are mounted directly on the circuit board, then the module can be assembled, but defective units require complete re-mounting
Solution Approach 1:
The invention segments the circuit into replaceable insulating substrates that can be independently inspected and replaced. When a defect is detected during or after assembly, only the defective substrate needs to be removed and replaced, rather than re-mounting all circuit elements. This significantly improves assembly efficiency and reduces defect handling complexity.
Solution Approach 2:
The invention enables discarding and recovering by allowing defective insulating substrates to be easily removed and replaced with good ones. The good substrates, which have been pre-assembled and inspected, can be recovered and reused in subsequent assemblies, improving productivity by eliminating the need to re-mount all components when a defect is found.
Data Source
AI summary
A semiconductor module 1 according to one embodiment includes a first circuit board, circuit units and a first plate member; the circuit units include a second plate member, a vertical type transistor and a second circuit board; n first circuit unit of N circuit units electrically connect a back surface side conductive region to the first input interconnection pattern of the first circuit board; (N−n) second circuit unit of the N circuit units electrically connect the third conductive pattern and the fourth conductive pattern of the second circuit board to the first control interconnection pattern and the second input interconnection pattern of the first circuit board; the first plate member electrically connects the fourth conductive pattern of the first circuit units to the second plate member of the second circuit units; and the gate electrode pad of the vertical type transistor contained in the first circuit unit is electrically connected to the first control interconnection pattern of the first circuit board.