Dual-Sided Power Converter Module Cooling
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Solution Overview
Problem
Existing power converter designs face challenges in downsizing while maintaining efficient connections between semiconductor modules and control boards, as well as minimizing wiring inductance, which leads to increased switching losses and heat generation, making it difficult to achieve both size reduction and high efficiency.
Innovation Solution
The power converter design arranges semiconductor modules on both surfaces of a cooler, with control boards and a current detector positioned to sandwich the cooler, allowing for direct and shortest connections between the semiconductor modules, smoothing capacitors, and control boards, eliminating the need for additional components like snubber circuits and reducing wiring inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If semiconductor modules are arranged on both surfaces of the cooler to downsize the occupied floor area, then the area utilization is improved, but the connection between semiconductor modules and control board becomes problematic and wiring inductance increases
Solution Approach 1:
The patent transitions from a single-sided arrangement to a dual-sided arrangement of semiconductor modules on the cooler, utilizing both surfaces to reduce the occupied floor area. This dimensional change allows more modules to be mounted in the same footprint, improving area utilization while maintaining compact form factor.
Solution Approach 2:
The patent divides the control board into multiple separate control boards, with each control board positioned adjacent to and controlling the semiconductor modules on its respective side of the cooler. This segmentation eliminates the need for long control terminals extending across the cooler and simplifies the connection architecture.
2Device complexity
If control terminals extend in parallel to surfaces of the cooler to connect all semiconductor modules to one consolidated control board, then the control connection is simplified, but the wiring inductance increases and switching surge voltage becomes larger
Solution Approach 1:
The patent segments the single consolidated control board into multiple separate control boards, each positioned adjacent to the semiconductor modules it controls. This eliminates the need for long parallel-extending control terminals across the cooler, reducing control wiring length and inductance while simplifying the overall connection architecture.
Solution Approach 2:
The cooler structure itself serves as an intermediary platform that holds both the semiconductor modules and the control boards in close proximity. This allows direct, short connections between control boards and semiconductor modules without requiring long external wiring, thereby reducing inductance and switching surge voltage.
3Device complexity
If input wirings and output wirings are concentrated and arranged at one side of the cooler, then the wiring arrangement is simplified, but the smoothing capacitor cannot come close to the semiconductor modules and wiring inductance becomes larger
Solution Approach 1:
The patent distributes the wiring arrangements to both sides of the cooler, with input and output wirings of semiconductor modules on each side connected to smoothing capacitors positioned adjacent to that side. This dual-sided wiring arrangement allows smoothing capacitors to be placed close to the semiconductor modules, minimizing wiring length and inductance.
4Length of stationary object
If one control board is disposed to face each semiconductor module with divided control boards, then the connection distance is reduced, but additional components like connectors and harnesses are required which increases the device size
Solution Approach 1:
The patent integrates the control board functions directly adjacent to the semiconductor modules on the cooler, eliminating the need for separate connectors and harnesses. The control boards are positioned to directly interface with the semiconductor modules, merging the control and power conversion functions into a compact integrated assembly that reduces overall device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces switching losses, increases efficiency, and allows for a more compact design by minimizing wiring inductance and eliminating the need for additional components, resulting in a smaller and more cost-effective power converter.
Implementation Method 1
a cooler (1) for cooling the semiconductor modules (2)
Implementation Method 2
a cooler (1) for cooling the semiconductor modules (2)
Data Source
Figure 1
Figure 2
Figure 3~5
AI summary
In a power converter in which semiconductor modules are arranged on both surfaces of a cooler for downsizing, an excellent connection between control boards and a low inductance connection between smoothing capacitors and the semiconductor modules are performed at the same time. The semiconductor modules are disposed on both surfaces of the cooler, and control boards that control the semiconductor modules are arranged opposite to the respective semiconductor modules. The semiconductor modules and the cooler are held between the control boards. A current detector or a terminal block is disposed at a position perpendicular to a surface on which the cooler and the semiconductor modules contact each other, opposite to the cooler. The respective control boards disposed on both surfaces of the cooler are electrically connected by using wirings provided in the current detector or the terminal block.