Buried Layer Hall Sensor for Parallel Magnetic Field Detection
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Solution Overview
Problem
Existing Hall sensor elements face inefficiencies in measuring magnetic field components parallel to the semiconductor substrate plane, particularly due to low conductivity in deeper semiconductor regions and high manufacturing costs associated with traditional processes.
Innovation Solution
A Hall sensor element with an electrically conductive buried layer in the substrate allows for vertical directional components of the operating current and Hall voltage, enabling efficient measurement of magnetic fields parallel to the substrate surface, while being manufacturable using traditional semiconductor processes, thus reducing costs and increasing sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a vertical Hall sensor element is used to sense magnetic field components parallel to the substrate plane, then the measurement capability is improved, but the conductivity in deeper regions of the active semiconductor area becomes much lower than at the surface, reducing efficiency
Solution Approach 1:
The patent introduces a buried layer positioned at a depth within the semiconductor substrate, creating a three-dimensional contact structure. This allows the sensor to access deeper regions of the active area while maintaining electrical connection through the vertically extended buried layer, thereby enabling parallel field measurement without suffering from surface conductivity limitations
Solution Approach 2:
The buried layer acts as an intermediary conductive structure that bridges the surface contact terminals and the deeper active semiconductor regions. It provides a dedicated conductive pathway through the substrate, mediating between the surface-level electrical connections and the deeper sensing region, thus maintaining efficiency while enabling vertical measurement geometry
2Adaptability or versatility
If multiple discrete semiconductor substrate wafers are positioned perpendicular to various spatial directions for multidimensional measurement, then the measurement versatility is improved, but the manufacturing costs and space requirements increase
Solution Approach 1:
The patent combines multiple measurement capabilities into a single semiconductor substrate by integrating a buried layer structure that enables vertical Hall sensing. This merging approach allows one substrate to perform functions that previously required multiple discrete wafers, reducing manufacturing complexity and costs while maintaining multidimensional measurement versatility
Solution Approach 2:
The buried layer structure provides multi-functionality by enabling the same substrate to sense both perpendicular and parallel magnetic field components through different contact configurations. This universal design eliminates the need for specialized substrates for different measurement directions, reducing overall manufacturing costs and simplifying integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for efficient, cost-effective measurement of magnetic fields parallel to the substrate surface with high sensitivity, enabling two-dimensional or three-dimensional measurements without the need for additional complex manufacturing steps, and can be integrated with other semiconductor functions.
Implementation Method 1
Hall sensor elements based on the Hall effect are used in wide areas of technology for measuring the magnetic flux density of magnetic fields
Data Source
AI summary
The invention provides a Hall sensor element having a substrate, which has a main surface, having an electrically conductive active region, which extends from the main surface into the substrate, and having a first electrically conductive, buried layer in the substrate, which contacts the active region at a first lower contact surface. From another standpoint, the invention provides a method for measuring a magnetic field with the aid of such a Hall sensor element, in which an electrical measuring current is conducted through the active region between a first upper contact electrode at the main surface and the first lower contact surface. A Hall voltage is picked up in the active region along a path running inclined with respect to a connecting line between the first lower contact surface and the first upper contact electrode. Alternatively, a measuring current is conducted through the active region over such a path, and a Hall voltage is picked up between the first upper contact electrode and the first lower contact surface.