Buried Metal Wiring Flexible Substrate Manufacturing
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Solution Overview
Problem
The challenge in manufacturing metal wiring buried flexible substrates lies in the complexity of existing methods, which often result in high resistance, heat generation, and incomplete separation of metal wiring from the substrate due to the use of inorganic separators, leading to defects such as short circuits and residual materials.
Innovation Solution
A method involving the use of a sacrificial layer, either soluble in water or photodegradable, is employed to form and separate metal wiring from a flexible substrate, where a polymer layer is coated over the metal wiring, and then the sacrificial layer is removed using solvents or light, allowing for clear separation and integration of the metal wiring within the polymer layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inorganic separators are used to separate metal wiring from substrate, then separation process can be performed, but residual impurities remain on the substrate surface causing incomplete separation
Solution Approach 1:
The patent employs a water-soluble polymer separator that can be completely dissolved after serving its separation function. This disposable-like approach ensures that no residual impurities remain on the substrate surface, as the separator material itself becomes part of the washing process rather than requiring separate removal steps.
Solution Approach 2:
The patent changes the solubility parameter of the separator material from inorganic (insoluble) to organic/aqueous (soluble) characteristics. By selecting polymers that are soluble in water or specific organic solvents, the separator can be completely removed through dissolution, eliminating residual impurities and achieving complete separation.
2Productivity
If wiring width is decreased to form more wirings, then wiring density increases, but resistance increases and heat is generated
Solution Approach 1:
The patent transitions from planar wiring arrangements to three-dimensional buried wiring structures within the polymer substrate. By embedding wirings at different depths and utilizing the vertical dimension, the design achieves higher wiring density without increasing resistance, as current paths remain optimized and wiring cross-sectional areas are maintained.
Solution Approach 2:
The water-soluble polymer separator acts as an intermediary material that enables precise wiring formation and separation. It facilitates the creation of narrow, well-defined wiring structures while maintaining electrical properties, allowing high-density wiring patterns without the resistance penalties of conventional techniques.
3Reliability
If multi-layer circuit patterns are formed on circuit substrate, then electrical insulation is achieved, but manufacturing process becomes very complicated
Solution Approach 1:
The patent segments the circuit substrate into functional layers: the polymer substrate, the water-soluble separator layers, and the metal wiring layers. This segmentation allows each layer to be formed and processed independently, then assembled through a systematic dissolution and bonding process, reducing overall manufacturing complexity while maintaining multi-layer insulation capabilities.
Solution Approach 2:
The patent performs preliminary actions by forming the polymer substrate and separator layers before final wiring assembly. The water-soluble separators are positioned in advance to define wiring locations, and the polymer matrix is prepared beforehand to receive and hold the wiring structures, streamlining the overall manufacturing sequence.
4Ease of manufacture
If high temperature heat treatment is applied during electroplating, then metal wiring formation is achieved, but non-conductive materials requiring high temperature resistance are needed
Solution Approach 1:
The patent changes the processing temperature parameter from high temperature to low temperature by replacing conventional electroplating with a cold or warm process using the water-soluble polymer separator as a facilitating medium. This parameter change enables metal wiring formation without requiring high-temperature resistant materials, expanding material selection flexibility.
Solution Approach 2:
The patent substitutes the thermal field-based electroplating process with a chemical field-based process utilizing the water-soluble polymer separator. The separator's solubility characteristics enable metal deposition or formation through chemical means rather than thermal means, eliminating the need for high-temperature processing and associated material constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of flexible substrates with low resistance metal wiring, ensuring complete separation without residual impurities, suitable for applications in electronic devices like solar batteries and displays.
Implementation Method 1
separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3
Implementation Method 2
separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3
Data Source
AI summary
Disclosed are a method of manufacturing a metal wiring buried flexible substrate and a flexible substrate manufactured by the same. The method includes coating a sacrificial layer including a polymer soluble in water or an organic solvent, or a photodegradable polymer on a substrate (Step 1), forming a metal wiring on the sacrificial layer in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the sacrificial layer including the metal wiring formed thereon in Step 2 and curing (Step 3) and separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3 (Step 4).