Printed Circuit Aspects TRIZ Cases

A photosensitive resin composition cures at 200°C or lower using polyamic acid and heterocyclic amine compounds.

A wiring board positions a fixing member to avoid impedance mismatch at the signal conductor interface.

A circuit board uses metal layer hollows to detect adhesive overflow in peripheral areas without adding physical structures.

Front and back scribe lines equalize silicon density in brazed joints, eliminating braze stains and ensuring consistent metal layer dimensions.

Embedding components in a board through cavity shortens electrical paths to reduce noise and manufacturing complexity.

Distributing identification codes across copper foil layers resolves tracking confusion in multi-spec PCB manufacturing.

3D printed conductive ink wires link PCB pads to housing ports, eliminating cable harnesses and reducing manufacturing setup time.

Opposite surface conductive wires create redundant electrical pathways that maintain connectivity when primary wires break during manual soldering.

A dedicated support member absorbs mechanical stress at the lead pin root, preventing wiring breaks while maintaining high-frequency performance.

Embedding metal coins with micro-vias creates vertical thermal pathways that dissipate heat from high-density interconnect boards.

Vinylsilyl polysiloxane and hydrosilyl polysiloxane crosslink to form a flexible matrix that bonds inorganic fillers for thermal conductivity.

Pre-formed resin spacers prevent detachment during screw fastening, eliminating rework and maintaining insulation security.

A manufacturing process embeds a semiconductor device within insulation layers on a substrate.

Photosensitive resin layer with graded inorganic filler content optimizes adhesion and thermal expansion matching.

Elastic buckling portions deform to secure an integrated circuit, eliminating soldering and preventing component damage during removal.

Auxiliary discharge electrodes engage when main units fail due to temperature-induced melting, maintaining reliable electrostatic discharge protection.

A circuit board design uses varied test pad widths to ensure correct probe contact during electrical testing.

Silicon patches embedded in substrates increase I/O density and bandwidth while reducing thermal expansion mismatch and bump cracking.

Through-holes in a silicon nitride ceramic substrate improve position accuracy and mechanical strength to prevent breakage from vibration.

Separate overlay layers with transparent conductive tracks eliminate recesses, reducing production complexity and cost.

A dual conductive layer structure coats a smooth core with a roughened outer shell, enhancing adhesion while preventing resist fall-down during size reduction.

Fine-grain electro-deposited copper foil retains 85% tensile strength after heating, resolving mechanical weakness in fine-pitch wiring.

Rotating obconical structure adapts to varying PCB hole sizes while sloped coronal surfaces enable easy carrier tape detachment.

Core-free resin insulating layers reduce via conductor diameters, enabling shorter wiring distances for small-pitch terminal electrodes.

Projections and depressions in the insulating substrate create mechanical interlocking that prevents resin layer separation, stabilizing module characteristics.

A shared vertical wiring line connects multiple inductor ends to reduce exposed terminals.

Slits in the segmented reinforcement layer alleviate contraction stress during heat treatment, preventing misalignment and connection stripping.

Filled conductors in aligned holes connect rigid and flexible sections, eliminating connectors that fail under thermal expansion.

A heat-conductive mounting strip connects a printed circuit board to a bottom casing.

Sputtered alloy seed layer bonds conductor circuits to resin insulating layers, preventing peeling and signal noise under thermal stress.

Through-vias enable vertical LED connections on carrier substrates, reducing area usage while supporting high voltage AC power.

A supplementary component reinforces printed wiring board mounting portions to prevent warping and solder failure.

Widening specific mesh segments shadows signal lines to reduce crosstalk while maintaining via clearance and metal loading constraints.

Offset transmission lines and a ground layer void reduce noise in flexible circuits, enabling reliable high-speed signal transmission.

A vinyl-containing polyphenylene ether resin composition incorporates phosphorus salts to maintain low dielectric properties.

Frame-shaped elements isolate sensitive solderless contacts from potting compounds, resolving vibration protection trade-offs.

Automated dual-laser system severs traces and cuts panels to individualize assembled PCBs for specific SKUs in one step.

A wearable interface component integrates conductive threads into its housing structure to provide electromagnetic interference shielding.

Controlled copper concentration gradient prevents hard eutectic phase formation, suppressing breaking and deformation during thermal cycles.

A wiring circuit board uses single-layer terminals and connecting portions to reduce terminal thickness, resolving multi-layer stacking constraints.

A composition using high molecular weight polymeric acid deposits conductive polymers on dielectric substrates.

Segmented rails and a stop member allow the outer rail to slide along the inner rail, accommodating flexible circuitry without damage.

Water-soluble sacrificial layers dissolve to remove residual impurities and enable complete separation of buried metal wiring.

Temporary carrier layers support thin-film capacitors during lamination into build-up layers, reducing impedance and inductance without increasing package size.

An overflow groove on a flexible printed circuit contains excess solder paste, preventing inter-pad short circuits while ensuring strong connections.

Double-sided tape bonds the flexible wiring board to the backlight unit, reducing peripheral region area and stress on the wiring.

Liquid cavity coupling enables direct coolant contact with the metal core base plate for efficient heat transfer.

Transient voltage suppression diodes protect MIPI data transmission lines from electrostatic discharge interference by discharging excess voltage to ground.

Naphthalene epoxy resin and DOPO-containing novolac create a halogen-free composition with low dielectric constant.