Embedded Metal Coins for PCB Thermal Dissipation
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Solution Overview
Problem
High circuit density in electronic devices leads to thermal dissipation challenges in PCB assembly, particularly for high power systems, where existing methods are inefficient in transferring heat away from IC chips to heat sinks.
Innovation Solution
Embedding a metal coin in the PCB with micro-vias drilled to thermally couple with the coin, creating continuous heat conducting paths from the top to the bottom side of the board, enhancing heat transfer efficiency through the coin to a heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If high circuit density is implemented in PCB assembly, then electronic device functionality and integration are improved, but thermal dissipation efficiency deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation on the PCB surface to three-dimensional heat conduction by embedding metal coins within the PCB layers and creating vertical heat pathways through micro-vias. This dimensional change allows heat to be conducted through the thickness of the PCB board, providing an additional dimension for thermal management while maintaining high circuit density on the board surface.
Solution Approach 2:
The patent introduces metal coins as intermediary heat conduction elements embedded within the PCB structure. These coins serve as thermal mediators that bridge the heat source (IC chips) and heat sink, providing a high-thermal-conductivity pathway through the PCB board. The micro-vias with solid via plating act as additional intermediary elements to establish thermal coupling between the coins and the heat dissipation system.
2Device complexity
If conventional heat dissipation methods are used in high power systems, then device simplicity is maintained, but heat transfer efficiency deteriorates
Solution Approach 1:
The patent employs a composite heat dissipation structure combining different materials with complementary properties: metal coins (high thermal conductivity) embedded in PCB substrate, connected through micro-vias with solid via plating (copper or other conductive materials). This composite structure leverages the superior thermal conductivity of metals while integrating with the PCB manufacturing process, achieving enhanced heat transfer efficiency without requiring entirely new device architectures.
3Temperature
If metal coins are embedded in PCB and micro-vias are drilled, then heat transfer efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates coin embedding and micro-via formation into the PCB manufacturing process itself, performing these thermal management features as preliminary actions during board fabrication. The coins are embedded in sub-layers before final lamination, and micro-vias are drilled and plated during the standard PCB manufacturing sequence. This preliminary integration avoids post-assembly modifications and reduces overall manufacturing complexity despite the added thermal management features.
Solution Approach 2:
The patent merges the thermal management structure with the PCB manufacturing process, combining coin embedding, micro-via formation, and heat dissipation functionality into a single integrated manufacturing workflow. The solid via plating process simultaneously creates both electrical connections and thermal conduction pathways. This merging of functions and processes reduces the number of separate manufacturing steps and simplifies production despite the enhanced thermal management capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively transfers heat from high-density interconnect boards, improving thermal dissipation by establishing efficient heat conducting channels from the heat source to the heat sink, ensuring proper device operation.
Implementation Method 1
heat can be dissipated to the other side of the PCB and can be carried away by another heat sink device or a cabinet physically contacted to the coin
Implementation Method 2
The micro-vias, formed by a solid via plating, can transfer heat efficiently from the top side of the PCB to the bottom side of the PCB via the embedded coin
Data Source
AI summary
A method of and a device for dissipating/transferring heat through one or more solid vias and embedded coins are disclosed. The method and device disclosed herein can be used to transfer heat for a High Density Interconnect (HDI) board.