Flexible Wiring Board Bonding via Double-Sided Tape
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display apparatuses have a significant peripheral region that increases the area around the effective display region, making it difficult to reduce the gap between the curved flexible wiring board and the substrate or the light supply portion, which affects the overall performance and efficiency of the display.
Innovation Solution
A display apparatus configuration that includes a flexible wiring board bonded to the backlight unit using a double-sided tape, allowing for controlled thickness and reduced gap distance, thereby minimizing the peripheral region and enhancing bonding strength by increasing the bonding area between the tape and the backlight unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a paste-form resin is used to bond the substrate and wiring board, then bonding strength is achieved, but the peripheral region area is increased due to the need for a larger bonding area and curing space
Solution Approach 1:
The patent changes the bonding method from paste-form resin to double-sided tape, which has a controlled thickness parameter (1μm to 100μm) that enables precise gap control while reducing the required bonding area, thus decreasing the peripheral region without compromising bonding strength
Solution Approach 2:
The double-sided tape acts as an intermediary bonding material between the substrate and wiring board, providing both bonding function and precise thickness control, which eliminates the need for large bonding areas required by paste-form resin curing processes
2Area of stationary object
If the flexible wiring board is curved to reduce the gap with the substrate, then the peripheral region area is reduced, but the stress on the wiring increases
Solution Approach 1:
The patent controls the thickness parameter of the double-sided tape (1μm to 100μm) to precisely adjust the gap between the curved wiring board and substrate, enabling the wiring board to be curved for compactness while maintaining acceptable stress levels through optimized spacing
3Area of stationary object
If the gap between the flexible wiring board and light supply portion is reduced, then the peripheral region area is reduced, but the bonding precision requirement increases
Solution Approach 1:
The patent introduces a double-sided tape with controlled thickness (1μm to 100μm) as an intermediary element, which standardizes the bonding interface and reduces the precision requirements by providing a consistent spacing mechanism, thereby enabling reduced peripheral area without proportionally increasing manufacturing difficulty
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the peripheral region area, minimizes stress on the wiring, and enhances bonding strength, leading to improved performance and reduced risk of damage to the wiring, while allowing for easier assembly and potential repair.
Implementation Method 1
a double-sided tape having a base film and a pasting layer formed on each of both surfaces of the base film. The flexible wiring board is bonded to the second side surface of the light supply portion through the double-sided tape.
Data Source
AI summary
Performance of a display apparatus is improved. The display apparatus includes: a substrate having a side surface (first side surface); a backlight unit (light supply portion) having a side surface (second side surface); a flexible wiring board having a wiring electrically connected to a terminal (first terminal) and having an insulating film with flexibility covering the wiring; and a double-sided tape. The flexible wiring board is bonded to the side surface of the backlight unit through the double-sided tape.