Insulating Substrate Engagement Structure for Resin Adhesion
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Solution Overview
Problem
The existing module design experiences a low degree of adhesion between the resin layer and the connecting component, leading to potential separation and degradation of module characteristics.
Innovation Solution
Incorporating an engagement structure in the contact surface of the insulating substrate within the connecting component, featuring projections and depressions, to enhance adhesion between the resin layer and the connecting component, preventing separation and improving the strength of the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a resin layer is formed to cover the circuit board, mounting component, and connecting component, then protection from mechanical breakage and environmental factors is improved, but separation between the resin layer and connecting component occurs due to low adhesion
Solution Approach 1:
The engagement structure transforms the adhesion problem from a two-dimensional surface contact issue to a three-dimensional mechanical interlocking system. Protrusions extend into the resin layer and recesses receive the resin layer, creating depth-based anchoring that prevents separation while maintaining protective coverage.
Solution Approach 2:
The connecting component combines the insulating substrate material with the engagement structure (protrusions and recesses) to create a composite interface. This composite design integrates both the insulating function and the mechanical anchoring function into a single component system that works with the resin layer.
2Reliability
If the resin layer is disposed to cover the first principal surface, mounting component, and side surface of connecting component, then module characteristics are protected, but the resin layer and connecting component may detach due to low adhesion degree
Solution Approach 1:
The engagement structure utilizes curved or non-planar geometric features (protrusions and recesses) instead of flat surfaces. This curvature creates mechanical interlocking that resists detachment forces, enhancing the bond strength between the resin layer and connecting component while maintaining structural integrity.
Solution Approach 2:
The contact surface between the connecting component and resin layer is segmented into multiple engagement points (protrusions and recesses) rather than a single continuous interface. This segmentation distributes stress across multiple locations, preventing catastrophic failure and enhancing overall adhesion strength.
3Reliability
If an engagement structure with protrusions and recesses is formed in the contact surface of the insulating substrate, then adhesion between resin layer and connecting component is improved, but device complexity increases
Solution Approach 1:
The engagement structure is merged with the insulating substrate of the connecting component rather than being a separate element. The protrusions and recesses are integrated into the substrate itself, combining the insulating function with the mechanical engagement function in a single unified component, thereby minimizing additional complexity.
Data Source
AI summary
An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.