Heat-Conductive Mounting Strip for PCB Thermal Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The heat dissipation capability of communication apparatuses is poor, particularly in small box-type devices where the printed circuit board (PCB) is in point contact with the bottom case, limiting effective heat conduction and diffusion, and leading to heat aggregation and temperature issues for temperature-sensitive components.
Innovation Solution
The introduction of a heat-conductive mounting strip that connects the edge of the PCB to the bottom case, transforming point contact into surface contact, thereby enhancing the heat transfer and dissipation path, and the use of a heat-conductive filler material and copper sheets to improve thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the PCB is installed in a housing through traditional stud or bolt mounting, then the structure is simple and easy to manufacture, but the heat dissipation capacity is limited due to point contact
Solution Approach 1:
A heat-conductive mounting strip is introduced as an intermediary component between the PCB and the housing. This mounting strip has a first end connected to the PCB and a second end connected to the housing, creating a dedicated heat conduction path that transforms the point contact of traditional mounting into an extended surface contact for improved heat dissipation.
2Temperature
If a radiator is installed in the housing, then the heat dissipation surface area is increased, but the radiator is not in direct touch with the air outside the housing, limiting heat dissipation efficiency
Solution Approach 1:
The heat-conductive mounting strip merges multiple functions into a single component: it serves as both the mechanical mounting structure (replacing traditional studs or bolts) and as a heat conduction path. This integration eliminates the need for separate mounting hardware and creates a direct thermal connection from the PCB to the housing, improving heat dissipation efficiency without adding complexity.
3Device complexity
If the PCB is in point contact with the bottom case, then the mounting structure is simple, but the heat cannot be effectively conducted and diffused, leading to heat aggregation
Solution Approach 1:
The heat-conductive mounting strip extends the heat conduction path from a zero-dimensional point contact (traditional mounting) to a one-dimensional linear path, and potentially to a two-dimensional surface contact if the mounting strip has sufficient width. This dimensional expansion of the contact interface significantly increases the heat transfer area and effectiveness while maintaining structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves the heat dissipation capacity of the communication apparatus by creating a more efficient heat transfer path from the PCB to the bottom case, effectively addressing the limitations of conventional natural heat dissipation methods and reducing thermal resistance.
Implementation Method 1
The printed circuit board is mounted on the bottom case by the heat-conductive mounting strip. A lower end surface of the heat-conductive mounting strip is connected to the bottom case, and an upper end surface of the heat-conductive mounting strip is connected to the printed circuit board.
Implementation Method 2
In the natural heat dissipation, the heating components transfer their heat to a radiator by installing the radiator or other methods, the radiator has a large heat dissipation surface area, and the heat is spread to the surface of the radiator, and then is conducted to the neighboring air. The change of air temperature generates a density change, thereby a natural convection is generated under the action of gravity.
Implementation Method 3
In another embodiment, the components and the radiator radiate a certain amount of infrared heat to the outside, and a portion of the heat is transferred to the outside by this radiation in the form of electromagnetic waves.
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
Provided are a communication system and a communication device therefor, the communication device comprising a bottom casing and a printed circuit board mounted on the bottom casing, the communication device also comprising a heat conduction mounting strip, the printed circuit board being mounted on the bottom casing via the heat conduction mounting strip. A lower end surface of the heat conduction mounting strip is connected to the bottom casing, and an upper end surface of the heat conduction mounting strip is connected to the printed circuit board. Via application of the technical solution of the present invention, the communication device connects an edge of the printed circuit board to the bottom casing via the heat conduction mounting strip, so that a point contact of a printed circuit board and a bottom casing in the prior art becomes a surface contact, thereby improving the path for the printed circuit board to conduct and diffuse heat towards the bottom casing, and increasing the heat dissipation capability of the communication device.