Ceramic Substrate With Through-Holes for LED Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for packaging ceramic substrates for LED mounting face challenges in precise position registration and mechanical strength, particularly in applications like automobile headlights where vibration and heat dissipation are critical.
Innovation Solution
A ceramic substrate with through-holes and recessed portions on its edge surfaces facilitates easy registration and mounting of LED chips, enhancing position accuracy and mechanical strength, utilizing materials like silicon nitride for high heat conductivity and toughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a resin substrate is used for mounting LEDs, then the substrate has low weight and ease of manufacture, but the substrate has low strength and requires reinforcing members
Solution Approach 1:
The patent changes the material parameter of the substrate from resin to ceramic, fundamentally altering the strength characteristics. Ceramic substrates inherently provide high strength without requiring additional reinforcing members, thus resolving the contradiction between substrate strength and structural complexity.
2Manufacturing precision
If LED chips are mounted on a substrate, then luminous intensity is achieved, but position registration accuracy is insufficient leading to poor reflection and diffusion efficiency
Solution Approach 1:
The patent incorporates registration marks directly on the ceramic substrate before the LED mounting process. These pre-formed marks enable accurate position registration during subsequent manufacturing steps, improving positioning precision without complicating the overall manufacturing process.
3Reliability
If LEDs are mounted in a headlight, then luminous output is achieved, but vibration causes position deviation and potential damage
Solution Approach 1:
The patent uses ceramic as a composite material that combines high mechanical strength with good thermal conductivity. The ceramic substrate's inherent strength provides vibration resistance, while its composite structure (ceramic matrix with embedded features) maintains reliability under vibrational stress without compromising mechanical integrity.
4Reliability
If a complex heat pipe structure with bending sections is used for anti-vibration, then vibration absorption is improved, but device complexity and cost increase
Solution Approach 1:
The patent merges the heat dissipation function and the vibration resistance function into a single integrated ceramic substrate structure. The substrate simultaneously serves as the thermal management component and the mechanical support, eliminating the need for separate complex heat pipe structures with bending sections.
5Temperature
If the substrate requires high heat radiation ability, then thermal management is improved, but material selection is limited and manufacturing becomes more difficult
Solution Approach 1:
The patent changes the thermal conductivity parameter by selecting ceramic material, which inherently provides high heat radiation ability. This material parameter change achieves superior thermal management while ceramic's well-established manufacturing processes maintain reasonable ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures improved luminous intensity and visibility in LED lamps by reducing position deviations and preventing substrate breakage due to vibration, while maintaining high heat radiation ability and mechanical strength.
Implementation Method 1
utilizing materials like silicon nitride for high heat conductivity and toughness
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
Provided is an element mounting ceramic substrate having a through-hole and a recessed portion which is open on at least one side.