Direct Liquid Cooled Metal Core PCB Thermal Management
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Solution Overview
Problem
Conventional liquid cooling systems for metal core printed circuit boards (MCPCBs) introduce additional material layers that increase thermal resistance, acting as thermal bottlenecks and limiting heat dissipation efficiency.
Innovation Solution
A direct liquid cooled MCPCB system where a liquid cavity creating component is coupled to the base plate, allowing a liquid coolant to directly contact the base plate, minimizing thermal bottlenecks and reducing the number of components, with options for self-contained heat pipes or port-based coolant circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid cooling systems are attached to MCPCB using soldering, thermal pastes, thermal adhesives, or mechanical systems, then the cooling function is achieved, but additional material layers are introduced that increase thermal resistance and act as thermal bottlenecks
Solution Approach 1:
The patent removes the intermediate thermal interface materials (thermal paste, adhesives, solder layers) from the cooling system. The liquid coolant is extracted to contact the MCPCB base plate directly through a cavity, eliminating the thermal bottleneck created by multiple material layers while maintaining effective heat transfer.
Solution Approach 2:
The patent introduces a liquid cavity as an intermediary structure between the liquid coolant and the MCPCB base plate. This cavity allows the coolant to directly contact the base plate surface without requiring thermal interface materials, thus reducing thermal resistance while maintaining system integrity.
2Productivity
If multiple material layers are used to attach cooling systems to MCPCB, then the attachment is achieved, but thermal bottlenecks are created that limit heat dissipation efficiency
Solution Approach 1:
The patent extracts and removes the intermediate material layers (thermal paste, adhesives, solder) that create thermal resistance. By directly exposing the MCPCB base plate to liquid coolant through a cavity, the system achieves superior heat dissipation efficiency without the thermal bottlenecks imposed by multiple material interfaces.
3Temperature
If conventional cooling systems use additional components and material layers, then the cooling function is achieved, but thermal resistance increases and heat dissipation is limited
Solution Approach 1:
The patent removes unnecessary intermediate components and material layers from the cooling system. By allowing liquid coolant to directly contact the MCPCB base plate through an integrated cavity, the system achieves higher thermal dissipation rates with fewer components, eliminating the thermal resistance created by conventional multi-layer attachment methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal dissipation rates, allows higher input temperatures for cooling fluids, reduces energy consumption, simplifies production, and lowers production costs by eliminating unnecessary components and thermal bottlenecks.
Implementation Method 1
allowing a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB
Implementation Method 2
circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board
Data Source
AI summary
The present disclosure further contemplates a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board. In one example the present disclosure contemplates a direct liquid cooled MCPCB system that may include a liquid cavity creating component coupled to the base plate of a MCPCB allowing a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB. The direct liquid cooled MCPCB system may minimize thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems.