Electronic Component Embedded Substrate Via Conductor Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component embedded substrates with multilayer wiring structures face challenges in forming fine via holes in core materials impregnated with resin, limiting the design freedom of terminal electrodes and increasing wiring distances, especially when forming multiple terminal electrodes with small pitches.
Innovation Solution
The substrate incorporates multiple conductor and insulating layers, where at least one of the insulating layers is made of a resin material without a core, allowing for reduced via conductor diameters and improved routing distances for terminal electrodes with small pitches, and includes non-core areas or openings for further reducing via conductor sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a core material obtained by impregnating a core with a resin material is used for insulating layers, then the mechanical strength of the substrate is maintained, but it becomes difficult to form fine via holes and the wiring layout design freedom is reduced
Solution Approach 1:
The substrate is divided into multiple insulating layers with different material compositions. Specifically, the insulating layer adjacent to the outermost conductor layer containing terminal electrodes is made of a material allowing fine via hole formation, while other insulating layers use core materials for mechanical strength. This segmentation allows each layer to serve its specific function optimally.
Solution Approach 2:
Different insulating layers are assigned different material properties based on their functional requirements. The insulating layer near the terminal electrodes uses a material with low via hole formation difficulty for design flexibility, while other layers use core materials for structural support. This local differentiation of material quality resolves the contradiction between strength and design freedom.
2Volume of moving object
If terminal electrodes are formed with small pitch, then the substrate size can be reduced, but the wiring distance increases when using core materials
Solution Approach 1:
The insulating layers are segmented such that the layer adjacent to the outermost conductor layer with small-pitch terminal electrodes is made of a material facilitating fine via hole formation. This enables shorter and more direct wire routing, reducing wiring distance while maintaining compact substrate size.
3Quantity of substance
If via conductor diameter is reduced for small pitch terminal electrodes, then wiring density increases, but forming fine via holes becomes more difficult in core materials
Solution Approach 1:
The insulating layer adjacent to the outermost conductor layer is made of a material specifically selected for its ease of via hole formation, allowing fine via conductors to be formed without excessive difficulty. This local material optimization enables high wiring density while maintaining manufacturability.
Data Source
AI summary
To enhance the degree of design freedom of an outermost conductor layer in an electronic component embedded substrate. An electronic component embedded substrate includes conductor layers, insulating layers each of which is positioned between adjacent two of the conductor layers, and an electronic component embedded in the insulating layer. The conductor layer is positioned in the uppermost layer and includes a plurality of terminal electrodes exposed to one surface side. The insulating layers are each made of a core material obtained by impregnating a core with a resin material, while the insulating layers are made of a resin material not containing a core. Since the insulating layer is made of a resin material not containing a core, the diameter of a via conductor formed in the insulating layer can be reduced. Thus, even when the plurality of terminal electrodes are formed in the conductor layer with a small pitch, the routing distance of wires can be reduced.