Low Temperature Curable Photosensitive Resin Composition for PCB Dry Film
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Solution Overview
Problem
Conventional photosensitive resin compositions used in circuit boards face challenges with high temperature curing requirements, leading to limitations in heat resistance, bending resistance, and pattern-filling properties, particularly when used as protective films for printed circuit boards.
Innovation Solution
A photosensitive resin composition comprising polyamic acid with a specific repeating unit, a heterocyclic amine compound, a (metha)acrylate-based compound, a photoinitiator, and an organic solvent, which allows for curing at 200°C or lower, enhancing process stability and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If polyamic acid is used as a photosensitive resin to improve heat resistance and bending resistance, then mechanical properties are improved, but curing temperature must be 250°C or higher which causes oxidization and deterioration of copper circuit
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by introducing a specific copolymer containing carboxylic acid groups and using heterocyclic carboxylic acid anhydrides, which fundamentally alters the curing mechanism to enable low-temperature polyimidization at 200°C or lower while maintaining the desired mechanical properties
Solution Approach 2:
The patent creates a composite resin system combining polyamic acid with specific copolymers containing carboxylic acid groups and heterocyclic carboxylic acid anhydrides, where the synergistic interaction between components enables low-temperature curing while preserving heat and bending resistance
2Ease of manufacture
If conventional epoxy resin with acrylate is used to improve processability, then ease of manufacture is improved, but soldering heat resistance and flame retardancy are poor causing discoloration and delamination
Solution Approach 1:
The patent fundamentally changes the resin base from epoxy to polyamic acid-based photosensitive resin, which inherently provides superior heat resistance and flame retardancy while maintaining photosensitivity through the incorporation of carboxylic acid group-containing copolymers and heterocyclic anhydrides
3Strength
If photosensitive polyimide resin is used to improve heat resistance and bending resistance, then mechanical properties are improved, but it requires high temperature curing process which limits application in PCB preparation
Solution Approach 1:
The patent changes the curing temperature parameter from 250°C or higher to 200°C or lower by introducing carboxylic acid group-containing copolymers and heterocyclic carboxylic acid anhydrides, which enable low-temperature polyimidization and make the resin suitable for PCB preparation processes
Solution Approach 2:
The patent uses heterocyclic carboxylic acid anhydrides as intermediary substances that facilitate the polyimidization reaction at lower temperatures, acting as a mediator between the polyamic acid and the desired polyimide product, enabling the reaction to proceed at 200°C or lower
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables low-temperature curing, improving heat resistance, bending resistance, and pattern-filling properties, while maintaining excellent mechanical and soldering heat resistance, thus addressing the limitations of conventional resin compositions.
Implementation Method 1
a photoinitiator and an organic solvent... exposing it to UV along the pattern
Data Source
AI summary
The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties.