Laser Trace Severing and Depaneling for PCBa SKU Individualization
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Solution Overview
Problem
The existing methods for processing assembled printed circuit boards (PCBs) are time-consuming, expensive, and logistically complicated, leading to delays in transforming generic PCBs into specific stock keeping units (SKUs) and transporting them to market destinations, especially when depaneling is performed separately and often overseas.
Innovation Solution
A method using two lasers, one with a wavelength of 1200 nm or less and the other with a wavelength of 11 μM or less, to individually sever traces and depanel PCBs in a single automated process, allowing for rapid transformation of generic PCBs into specific SKUs and reducing the board size, which can be performed near the final market destination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If manual processing steps are used to individualize PCBa's for specific SKUs, then processing flexibility is maintained, but processing time and labor costs increase significantly
Solution Approach 1:
The patent replaces manual mechanical processing with an automated laser-based system. The laser processing system can automatically sever traces, depanel PCB panels, and modify PCBa's according to programmed instructions, eliminating the need for manual operations while maintaining processing flexibility through software control.
Solution Approach 2:
The patent utilizes different laser wavelengths (first laser with wavelength of 1200 nm or less, second laser with wavelength of 11 μm or less) to achieve different processing effects. By changing laser parameters such as wavelength, power, and pulse duration, the system can perform multiple operations (trace severing, depaneling, marking) with a single automated system.
2Ease of manufacture
If depaneling is performed separately from individualization processing, then each process can be optimized independently, but logistical complexity and transportation requirements increase
Solution Approach 1:
The patent combines multiple post-processing operations (trace severing, depaneling, marking) into a single integrated laser processing system. This allows all operations to be performed in one location and one continuous process, eliminating the need for separate processing locations and reducing logistical complexity while maintaining operational optimization through programmed sequences.
3Productivity
If generic PCBa's are manufactured in advance for multiple SKUs, then manufacturing efficiency is improved, but inventory costs and time to deliver specific SKUs increase
Solution Approach 1:
The patent manufactures generic PCBa's in advance with all necessary components installed but with traces remaining connected. The PCBa's are prepared in a universal configuration that can be quickly adapted to any specific SKU through automated laser trace severing and depaneling operations performed close to the final destination, enabling just-in-time delivery without long lead times.
4Manufacturing precision
If multiple different lasers are used for different processing steps, then processing precision is improved, but device complexity increases
Solution Approach 1:
The patent employs a multi-functional laser processing system that can perform multiple operations (trace severing, depaneling, marking) using different laser wavelengths. The system is designed to accommodate multiple laser types (fiber laser, UV laser for trace severing; CO2 laser for depaneling) within a single integrated platform, reducing the need for multiple separate devices while maintaining high precision for each operation type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces processing time, minimizes labor and logistical complexities, and enables 'just-in-time' manufacturing by allowing for rapid transformation of generic PCBs into specific SKUs with minimal lag time, enabling quicker response to consumer demands and reducing inventory costs.
Implementation Method 1
severing at least one trace on each PCBa using the first laser to individualize the PCBa's
Implementation Method 2
depaneling the PCBa panel to separate the plurality of connected PCBa's using the second laser
Data Source
AI summary
A method for processing a PCBa panel to individualize the PCBa's on the PCBa panel and depanel the PCBa panel in substantially one step is described. The PCBa panel initially comprises a number of PCBa's having components and traces common to a number of different product SKUs. During processing, the PCBa panel is loaded into a machine containing a first and second laser. The first laser severs extra traces on each PCBa to individualize the PCBa's for specific SKUs and the second laser cuts the links between each PCBa, thereby depaneling the PCBa panel.