Socket Assembly Elastic Buckling Mechanism for IC Replacement
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Solution Overview
Problem
The existing Surface Mount Technology (SMT) for mounting ICs on circuit plates makes it difficult and time-consuming to replace ICs, as the tin element connecting the IC and the circuit plate must be melted, and the IC can be damaged during removal.
Innovation Solution
A socket assembly with a first and second fixing member, each comprising buckling and installed portions connected by elastic arms, allowing for secure engagement and easy removal of the IC, using elastic deformation to lock and unlock the IC within the socket.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If SMT is used to mount IC on circuit plate, then the IC is firmly fixed, but the IC becomes difficult and time-consuming to remove
Solution Approach 1:
The socket assembly is divided into separate components: a socket body with buckling portions and elastic connecting portions, and a separate IC. The socket body itself is segmented into multiple installed portions and buckling portions that can independently deform elastically, allowing the IC to be inserted and removed without affecting the entire assembly structure.
Solution Approach 2:
The elastic connecting portions provide dynamic flexibility to the socket structure. When the IC is inserted, the buckling portions deform elastically to accommodate the IC, then return to their original shape to secure the IC firmly. For removal, the buckling portions can deform again to release the IC, enabling quick and easy replacement without permanent damage.
2Stability of the object's composition
If SMT is used to mount IC on circuit plate, then the IC is firmly fixed, but the IC can be damaged during removal
Solution Approach 1:
The socket body acts as an intermediary between the circuit plate and the IC. The elastic connecting portions and buckling portions of the socket body absorb the mechanical stress and deformation during IC insertion and removal, protecting the IC from direct damage. The socket structure distributes the forces evenly, preventing concentrated stress on the fragile IC components.
Solution Approach 2:
The elastic connecting portions are designed to deform beforehand during the insertion process, cushioning the impact force before the IC fully engages with the socket. This pre-deformation absorbs shock and prevents sudden stress spikes that could damage the IC during the mounting or removal process.
3Ease of operation
If the IC is easily removable from the socket, then replacement is convenient, but the electrical connection may become unreliable
Solution Approach 1:
The elastic connecting portions change their physical state between deformed and recovered states. During IC insertion, they deform to accommodate the IC, then return to their original shape to establish firm electrical contact. This parameter change allows the connection to transition smoothly between the insertion and secured states, ensuring reliable electrical connection while maintaining ease of removal through controlled deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables convenient and speedy assembly and disassembly of ICs, ensuring quick and secure engagement and removal without damaging the IC, while maintaining reliable electrical connections.
Implementation Method 1
a plurality of elastic connecting portions (151, 161) elastically interconnecting the first buckling portion (152) and the second buckling portion (162)
Data Source
AI summary
An exemplary socket assembly includes a circuit plate and a socket mounted on the circuit plate for fixing an IC. The socket includes a first fixing member and a second fixing member. The first fixing member includes installed portions, elastic connecting portions, and a first buckling portion, the elastic connecting portions interconnects the electric portions and the first buckling portion. The second fixing member includes electric portions, elastic connecting portions, and a second buckling portion, and the elastic connecting portions interconnect the electric portions and the second buckling portion. Wherein when the IC is attached to the socket, the first buckling portion and the second buckling portion are initially disengaged from each other, pins of the IC is electrically connected with the electric portions, the first buckling portion and the second buckling portion are brought together with the elastic connecting portions elastically deforming, and the first buckling portion and the second buckling portion are locked together and hold the IC in the socket.