Variable-Width Mesh Planes for Crosstalk Reduction in Multilayer Ceramic Packages

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Solution Overview

Problem

Multilayer ceramic packages experience crosstalk interference due to increased signal rising and falling edge rates and bus signaling speeds, limiting signaling rates and performance, and existing manufacturing processes face challenges in balancing signal integrity and metal loading requirements.

Innovation Solution

A method and apparatus that adjust mesh line segments in multilayer ceramic packages to varying widths, with wider segments positioned to shadow signal lines while maintaining via clearance and metal loading limits, reducing crosstalk and metal fill by selectively widening mesh lines and removing unnecessary segments to meet manufacturing requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If mesh line segments are widened to shadow signal lines and reduce crosstalk, then signal integrity is improved, but metal loading requirements are exceeded

Engineering Contradiction:
Improvesignal integrityVSAvoidmetal loading
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent applies local quality by varying the width of mesh line segments based on their specific position and function. Mesh line segments that shadow signal lines are widened to reduce crosstalk and improve signal integrity, while other segments maintain standard width to minimize overall metal loading. This localized differentiation allows the structure to optimize signal protection only where needed rather than uniformly across the entire mesh layer.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent segments the mesh layer into multiple independent mesh line segments that can be individually controlled in width. By dividing the continuous mesh structure into discrete segments, the design allows selective widening of specific segments that shadow signal lines while keeping other segments at standard width, thereby balancing crosstalk reduction with metal loading constraints.

Inventive Principle:
Principle #1Segmentation

2Productivity

If mesh line segments are widened to reduce crosstalk, then signaling rates are enhanced, but manufacturing precision requirements become more difficult to meet

Engineering Contradiction:
Improvesignaling ratesVSAvoidvia clearance
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by differentiating mesh line segment widths based on proximity to vias. Mesh line segments that shadow signal lines and are positioned away from vias are widened to enhance signaling rates and reduce crosstalk, while segments near vias maintain standard width to ensure adequate via clearance and meet manufacturing precision requirements.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If uniform mesh line width is used, then manufacturing is simplified, but crosstalk reduction effectiveness is limited

Engineering Contradiction:
Improvemesh fabricationVSAvoidcrosstalk reduction
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent resolves this contradiction by implementing local quality through variable mesh line segment widths. The manufacturing process is simplified by using only two discrete width values (standard width and widened width) rather than continuous variation, while still achieving effective crosstalk reduction through strategic placement of widened segments that shadow signal lines.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS9955567B2Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
Publication Date: 2018.04.24 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US9955567B2 patent drawing
  • US9955567B2 patent drawing
  • US9955567B2 patent drawing

AI summary

A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.