Embedded Component Structure With Through Cavity
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Solution Overview
Problem
The existing embedded component structures have long electrical transmission paths between electronic components and printed circuit boards, leading to decreased power and signal quality, increased noise, and complex manufacturing processes with thicker thicknesses.
Innovation Solution
A thinner embedded component structure is achieved by using a board with a through cavity and a dielectric material layer, where the electronic component is embedded within the cavity, and a connection circuit layer is formed to contact the conductive members and electrodes, eliminating the need for conductive vias and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive through vias are used to electrically connect the electronic component to the printed circuit board, then electrical connection is achieved, but the electrical transmission path becomes long causing decreased power and signal quality
Solution Approach 1:
The patent transitions from traditional vertical through-via connections to a planar integration approach where the electronic component is embedded within the circuit board plane. The connection circuit layer creates a shortened transmission path by directly contacting the conductive member and electrode within the same board structure, effectively changing the dimensional arrangement of electrical connections.
2Reliability
If conductive through vias are used for electrical connection, then connection is established, but noise increases and S/N ratio decreases
Solution Approach 1:
The patent extracts the electronic component from the traditional through-via connection system and embeds it directly within the circuit board structure. This removes the component from the harmful electromagnetic environment of long transmission paths and multiple via interfaces, isolating it from noise sources while maintaining electrical connection through the connection circuit layer.
3Reliability
If traditional embedded component structure with conductive vias is used, then electrical connection is achieved, but the manufacturing process becomes more complicated and thickness increases
Solution Approach 1:
The patent merges the electronic component with the circuit board structure by embedding the component within the board and integrating the connection circuit layer directly onto the board surface. This consolidation eliminates the need for separate through-via structures and reduces the overall assembly complexity, while the dielectric material layer provides both insulation and structural support.
Data Source
AI summary
An embedded component structure includes a board, an electronic component, and a dielectric material layer. The board has a through cavity. The board includes an insulating core layer and a conductive member. The insulating core layer has a first surface and a second surface opposite thereto. The through cavity penetrates the insulating core layer. The conductive member extends from a portion of the first surface along a portion of the side wall of the through cavity to a portion of the second surface. The electronic component includes an electrode. The electronic component is disposed in the through cavity. The dielectric material layer is at least filled in the through cavity. The connection circuit layer covers and contacts the conductive member and the electrode. A manufacturing method of an embedded component structure is also provided.