LED Integration Scheme Using Through-Vias for Compact AC Power
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Solution Overview
Problem
Existing methods for integrating light-emitting diodes (LEDs) into electrical circuits require large substrate areas when using high voltage AC power, making it difficult to create compact AC-powered LED devices.
Innovation Solution
A circuit structure using a carrier substrate with through-vias and contact pads on both surfaces, allowing LED chips to be bonded on one surface and connected via wires on the opposite surface, reducing substrate area usage and heat impact on the LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If LEDs are connected in series on a single surface to accommodate high voltage AC power, then the device can be directly powered by AC power without drive circuits, but the substrate area required becomes excessively large
Solution Approach 1:
The patent transitions from a two-dimensional single-surface layout to a three-dimensional structure utilizing both surfaces of the substrate. Through-vias penetrate the substrate to establish electrical connections between LED chips mounted on opposite surfaces, effectively adding the vertical dimension to the circuit layout. This allows high-voltage series connections to be distributed across multiple layers rather than confined to a single plane, dramatically reducing the required substrate footprint while maintaining direct AC power capability
2Power
If more LED groups are connected in series to handle higher voltage AC power, then higher voltage AC power sources can be used, but the substrate area increases even further
Solution Approach 1:
The patent divides the LED circuit into multiple modular groups distributed across different surfaces and connected through through-vias. Each LED group can be independently configured for specific voltage requirements, allowing the system to scale to higher voltages by simply adding more series-connected groups in the vertical dimension rather than expanding the horizontal substrate area. This segmentation enables flexible adaptation to different AC power standards
Solution Approach 2:
By utilizing the vertical dimension through substrate penetration and multi-surface mounting, the patent enables higher power handling capability without proportional increases in substrate area. The through-via architecture allows series connections to stack vertically, so that doubling the power handling capability requires minimal additional lateral space compared to traditional single-surface layouts
3Ease of manufacture
If all circuit elements are disposed on a single surface, then the fabrication process is simplified, but the device cannot be compact
Solution Approach 1:
The patent employs through-vias to route electrical connections through the substrate thickness, enabling circuit elements to be distributed on opposite surfaces. This vertical routing approach maintains fabrication simplicity by using standard via formation processes while achieving compact device footprint. The multi-surface architecture allows dense packing of LED chips and circuit elements without requiring complex lateral interconnections
Data Source
AI summary
A circuit structure includes a carrier substrate, which includes a first through-via and a second through-via. Each of the first through-via and the second through-via extends from a first surface of the carrier substrate to a second surface of the carrier substrate opposite the first surface. The circuit structure further includes a light-emitting diode (LED) chip bonded onto the first surface of the carrier substrate. The LED chip includes a first electrode and a second electrode connected to the first through-via and the second through-via, respectively.