Buried PCB Contact Taps for Memory Module Insertion Force Reduction
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Solution Overview
Problem
The increasing number of contact pins and contact taps in memory modules leads to higher insert forces, causing defects such as cracks in memory packages and chips, and contamination issues due to their surface location, making it difficult to increase density and prevent scratches.
Innovation Solution
A memory module/socket assembly with contact taps buried in the side surfaces of the PCB, connected internally to memory packages via conductive layers, and a socket design that allows contact pins to move and contact these taps without additional force, reducing stress and contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of contact pins and contact taps is increased to increase memory module capacity, then the memory module density is improved, but the insert force increases causing cracks in memory packages and chips
Solution Approach 1:
The contact taps are repositioned from the top surface to the side surface of the PCB, changing the spatial dimension of contact establishment. This allows contact pins to approach horizontally rather than vertically, enabling increased contact density without proportionally increasing insert force on memory packages.
Solution Approach 2:
The socket is designed with a pin moving member that enables the contact pins to move dynamically from an initial position to a contact position after the memory module is inserted. This dynamic movement allows the contact pins to establish electrical connection without applying excessive force during the insertion process, preventing damage to memory packages.
2Quantity of substance
If contact taps are formed on the surface of the PCB to increase the number of contacts, then the electrical connection capacity is improved, but the contact taps become vulnerable to contamination and scratches
Solution Approach 1:
The contact taps are relocated from the top surface to the side surface of the PCB, embedding them in a position that is less exposed to contamination sources such as solder splashes and flux. This spatial repositioning protects the contact taps while maintaining electrical connection functionality.
Solution Approach 2:
The contact taps are buried within the PCB structure rather than being exposed on the surface. The side surface positioning effectively nests the contact taps within the PCB body, protecting them from external harmful factors while still allowing electrical connection through the exposed portion.
3Quantity of substance
If additional I/O pins for power supply and ground are added to increase density, then the electrical connection capacity is improved, but the total number of contact pins becomes insufficient
Solution Approach 1:
By utilizing the side surface of the PCB for contact taps, the invention creates additional space for I/O pins without increasing the top surface density requirements. This enables incorporation of additional power supply and ground pins while maintaining manageable manufacturing complexity.
Data Source
AI summary
Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.