Printed Circuit Aspects TRIZ Cases
- Vertically Mounted Power Control Assembly for Aircraft Circuit Density
Vertical distribution bars mount power switches to utilize wasted volume, resolving the contradiction between board area limits and system space constraints.
- Electric Connection Box Compact Design via Connector Repositioning
A compact electric connection box positions a connector beside the circuit board to minimize dead space and reduce overall height.
- Wiring Substrate Seed Layer Adhesion via Inorganic Particle Surface Control
A wiring substrate uses sputtered seed layers on resin insulating layers containing inorganic particles to form conductive vias.
- Microparticle-Filled Resin Laminate for Circuit Boards
Distributed microparticles in resin layers replace glass fibers to maintain mechanical strength while matching dielectric constants.
- Embedded PCB Pad Structure for Thermal Stress Resistance
Exposed corner pads and covered inner pads distribute thermal stress during substrate bonding, preventing bond fractures.
- Crystalline Epoxy Resin for Radiant Heat Circuit Boards
A crystalline epoxy resin compound with inorganic filler forms an insulating layer on a metal plate.
- Buried PCB Contact Taps for Memory Module Insertion Force Reduction
Buried side-surface contact taps on a printed circuit board reduce insertion stress and contamination risks while enabling higher pin density in memory modules.
- Communications Module Heat Sink Substrate Contact
A communications module design places a heat sink directly against a communication unit via a thermally conductive member to optimize thermal management.
- Multi-layer micro-wire transparent electrodes for touch screens
Multi-layer micro-wire structures integrate conductive metal wires within transparent polymer substrates to form hybrid electrode assemblies.
- Display Device Thin Bezel Segmentation and Chassis Protection
Segmenting the non-display area protects wiring durability while a protective film secures the chassis member for easy reassembly.
- Protective Conductor Track for Overvoltage Protection on Conductive Structures
A protective conductor track merges with existing layers to discharge electrostatic charges, preventing voltage flashover damage during roll-to-roll production.
- Halogen-Free Prepreg for High Heat Resistance
A prepreg composition combines cyanate ester resin with boehmite and silicone powder to deliver high flame resistance.
- Embedded Metal Bump PCB Solder Resist Open Pattern
A printed circuit board embeds metal bumps in a core layer with an open solder resist pattern to fill void spaces.
- Thin Board Assembly Sheet With Edge Through Holes
Through holes along mounting board edges reduce dicing blade impact, preventing breakage of thin flexible circuit boards during singulation.
- Resin Composition for High-Speed Circuit Substrates
A resin composition using a polyolefin prepolymer and vinyl thermosetting polyphenylene ether forms a cross-linked network structure.
- Laminate With Mixed Glass Fiber Layers For Drilling And Thermal Expansion
A laminate uses distinct glass fiber layers to balance rigidity and thermal stability.
- Laminated Composite Assembly Voltage Stress Dielectric Optimization
Variable thickness dielectric layers provide electrical isolation between conductors based on local voltage stress, reducing assembly thickness and weight.
- Mezzanine Connector With Opposite Mounting Tails
A mezzanine connector unifies side-by-side wafers with opposite mounting tails for direct circuit board attachment.