Microparticle-Filled Resin Laminate for Circuit Boards
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Solution Overview
Problem
Traditional circuit boards constructed with layers of resin and glass fibers suffer from signal skew and loss due to differences in dielectric constant and dissipation factors between the resin and glass fibers, especially at higher frequencies and with increasing signal routing densities.
Innovation Solution
Incorporating a plurality of microparticles into the resin layers of circuit boards, which can be randomly distributed to eliminate issues associated with glass fibers, thereby reducing signal losses and skew.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass fibers are used in resin layers to provide mechanical strength, then the structural strength is improved, but signal skew and loss increase due to dielectric constant differences
Solution Approach 1:
The patent changes the dielectric parameter by replacing glass fibers with microparticles that have a dielectric constant matching the resin material (approximately 3.5-4.5), thereby eliminating signal skew while maintaining mechanical strength through the distributed microparticle structure
Solution Approach 2:
The patent creates a composite material system consisting of resin and microparticles, where the microparticles serve dual functions: maintaining mechanical strength through distribution throughout the resin while simultaneously providing signal integrity by matching dielectric properties and reducing signal loss
2Strength
If glass fibers are woven in a crisscross pattern to provide strength, then mechanical strength is improved, but signal loss increases at higher frequencies
Solution Approach 1:
The patent changes the material composition from glass fibers to microparticles with matched dielectric properties, which reduces the dissipation factor and thereby minimizes signal loss at higher frequencies while maintaining the mechanical strength function
Solution Approach 2:
The patent uses inexpensive microparticles that can be randomly distributed throughout the resin, replacing the more complex glass fiber weaving process, achieving both cost reduction and improved high-frequency signal performance
3Productivity
If signal routing density is increased to handle more information, then productivity is improved, but signal skew and loss worsen due to proximity to glass fibers
Solution Approach 1:
By changing the dielectric parameters of the laminate material through the use of microparticles with matched dielectric constants, the patent enables higher signal routing densities without the signal integrity degradation that would normally occur with increased proximity to high-dielectric glass fibers
Data Source
AI summary
A circuit board may include at least one layer of resin and a plurality of microparticles distributed throughout the at least one layer of resin.