Resin Composition for High-Speed Circuit Substrates
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Solution Overview
Problem
Existing resin compositions for high-speed electronic circuit substrates face challenges with incompatibility issues between polyolefin resins and maleimides, leading to phase separation, poor heat resistance, and delamination during lead-free reflow soldering due to the use of monofunctional maleimides and thermoplastic polyphenylene ethers without vinyl reactive groups.
Innovation Solution
A resin composition comprising a prepolymer of polyolefin resin and bifunctional or polyfunctional maleimide, combined with vinyl thermosetting polyphenylene ether, which forms a three-dimensional cross-linked network structure, enhancing heat resistance and dielectric properties by controlling the prepolymerization process and incorporating a radical initiator and flame retardants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If monofunctional maleimide and thermoplastic polyphenylene ether are used in resin composition, then dielectric properties are improved, but heat resistance deteriorates and phase separation occurs
Solution Approach 1:
The patent changes the functional group parameter of maleimide from monofunctional to bifunctional or polyfunctional, and modifies polyphenylene ether to contain vinyl reactive groups. This parameter change enables crosslinking reactions that form a three-dimensional network structure, simultaneously improving heat resistance while maintaining dielectric properties.
Solution Approach 2:
The patent creates a composite resin system combining polyolefin resin, bifunctional/polyfunctional maleimide, and vinyl-modified polyphenylene ether. This composite material approach allows the components to work synergistically, with the crosslinked network providing heat resistance and the polyphenylene ether maintaining low dielectric constant and loss.
2Ease of manufacture
If polyolefin resin and maleimide are mixed directly, then manufacturing is simplified, but compatibility deteriorates causing phase separation and turtle-like cracks
Solution Approach 1:
The patent performs preliminary modification of polyphenylene ether by introducing vinyl reactive groups before mixing with maleimide. This preliminary action ensures chemical compatibility and prevents phase separation during mixing, while still allowing straightforward manufacturing processes.
Solution Approach 2:
The vinyl reactive groups on polyphenylene ether act as an intermediary that facilitates compatibility between polyolefin resin and maleimide. These reactive groups enable crosslinking reactions that bridge the previously incompatible components, creating a homogeneous composition.
3Quantity of substance
If thermoplastic polyphenylene ether is used without vinyl reactive groups, then dielectric constant is reduced, but crosslinking capability is lost resulting in poor heat resistance
Solution Approach 1:
The patent modifies the chemical structure parameter of polyphenylene ether by introducing vinyl reactive groups. This modification maintains the low dielectric constant property while adding crosslinking capability through reactions with maleimide, resolving the contradiction between dielectric performance and heat resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform prepreg appearance, prevents phase separation, and significantly improves heat resistance, thermal stability, and dielectric properties, ensuring reliable performance for high-speed electronic circuit substrates without delamination after multiple lead-free reflow soldering processes.
Implementation Method 1
incorporating a radical initiator and flame retardants
Implementation Method 2
the relationship between signal transmission rate and dielectric constant Dk of insulating material in high-speed circuit
Data Source
AI summary
Provided in the present invention are a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of a polyolefin resin and a bifunctional maleimide or a multifunctional maleimide; and, (B) vinyl thermosetting polyphenylene ether, where with the weight of the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide being 100 parts by weight, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight. The present invention, by employing the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the polyolefin resin and vinyl thermosetting polyphenylene ether. An aqueous glue solution so mixed is uniform and consistent, the pre-preg has a uniform expression, and a substrate resin area is free of a phase-separation problem.