Communications Module Heat Sink Substrate Contact
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Solution Overview
Problem
Conventional communication modules face challenges in heat dissipation due to thermal resistance from substrates, leading to inefficient heat transfer between communication units and heat sinks.
Innovation Solution
A communication module design featuring a substrate with holes, where a communication unit and heat sink are directly contacted through a thermally conductive member, minimizing thickness and optimizing heat dissipation using air, water, or combined cooling methods, and incorporating connectors for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a substrate is disposed between the communication unit and the heat sink, then the communication module can be assembled with standardized components, but the heat dissipation performance deteriorates due to thermal resistance of the substrate
Solution Approach 1:
The patent removes the substrate from the heat dissipation path between the communication unit and the heat sink. By extracting the substrate out of the thermal conduction path and using it only for electrical connections (via connectors), the thermal resistance barrier is eliminated, allowing direct thermal contact between the communication unit and heat sink while maintaining assembly capability through separate connector-based electrical connections.
Solution Approach 2:
The patent introduces connectors as intermediary elements that separate the electrical connection function from the thermal conduction path. The connectors handle only electrical signals between the communication unit and substrate, while allowing direct thermal contact through the communication unit's bottom surface to the heat sink, thus mediating between electrical connectivity requirements and thermal performance needs.
2Temperature
If the communication unit and heat sink are directly contacted, then heat dissipation performance improves, but the structural complexity increases
Solution Approach 1:
The patent merges the thermal conduction function and electrical connection function into separate pathways. The communication unit directly contacts the heat sink for thermal conduction, while connectors handle electrical connections. This merging of functions into distinct paths simplifies the overall structure by eliminating the need for complex substrate-integrated thermal-electrical management systems.
Solution Approach 2:
The patent segments the heat dissipation and electrical connection functions into separate structural pathways. The direct contact between communication unit and heat sink forms one segment for thermal management, while connectors form another segment for electrical connections. This segmentation reduces structural complexity by allowing each segment to be optimized independently without compromising the other.
3Length of moving object
If holes are formed in the substrate to minimize thickness, then the vertical thickness is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent extracts the heat dissipation function from the substrate by removing the substrate from the thermal path entirely. This eliminates the need for complex hole-forming operations in the substrate for heat management purposes, as the communication unit directly contacts the heat sink. The substrate's role is reduced to providing a mounting platform for connectors, simplifying its manufacturing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance, reduces module thickness, and simplifies manufacturing, allowing for compact and efficient heat management in communication modules.
Implementation Method 1
a thermally conductive member disposed between the heat sink and the second substrate
Implementation Method 2
a heat sink disposed on the other surface of the second substrate
Data Source
AI summary
Disclosed according to an embodiment is a communications module comprising: a first substrate having a first hole formed herein; a communications unit including a second substrate and a plurality of elements disposed on one side of the second substrate; and a heat sink disposed on the other side of the second substrate, wherein a peripheral region of the second substrate is disposed so as to vertically overlap with the periphery of the first hole of the first substrate. Accordingly, the communications module can realize an optimized heat dissipation structure in which the communications unit and the heat sink are in contact with each other on the substrate by using a thermally conductive member as a medium.