Buried Via Formation Using Embedded Solder in PCB Lamination
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Solution Overview
Problem
Conventional methods for creating buried vias in printed circuit boards are time-consuming, labor-intensive, and expensive, requiring multiple heating steps and specialized equipment like lasers, and often involve the buried via passing through a core, which complicates the manufacturing process.
Innovation Solution
A method involving the use of multilayer cores with embedded solder elements in uncured dielectric material, where the solder elements have a melting point close to the curing temperature of the dielectric, allowing for a single lamination step to form buried vias without the need for specialized heating equipment, and enabling better connectivity and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to create buried vias with multiple heating steps and laser equipment, then via formation is achieved, but manufacturing time and cost increase significantly
Solution Approach 1:
The patent combines the heating step for melting solder with the lamination process into a single operation. The lamination heater that cures the dielectric material simultaneously melts the solder elements to form buried vias, eliminating the need for separate laser heating steps and reducing manufacturing time while maintaining via formation precision
Solution Approach 2:
The lamination heater is given a dual function: it both cures the dielectric material and melts the solder elements. This multi-functional approach eliminates the need for specialized laser equipment, simplifies the manufacturing process, and reduces costs while achieving the same via formation result
2Reliability
If conventional methods with multiple heating steps are used, then solder elements are melted to form vias, but process complexity and equipment requirements increase
Solution Approach 1:
The patent merges the solder melting function with the lamination process, so that one heating operation accomplishes both dielectric curing and via formation. This eliminates the need for multiple heating steps and specialized laser equipment, reducing process complexity and equipment requirements while maintaining reliable via connectivity
Solution Approach 2:
The lamination process itself provides the heating function needed for solder melting. The standard lamination heater that is already part of the manufacturing equipment performs the dual function of curing dielectric and melting solder, eliminating the need for additional specialized heating equipment or processes
3Reliability
If buried vias are formed through cores with conventional methods, then electrical connectivity is achieved, but manufacturing cost and labor intensity increase
Solution Approach 1:
Solder elements are embedded in the dielectric material before lamination, positioning them in advance where the buried vias need to be formed. This preliminary placement eliminates the need for complex post-lamination via formation steps, making the manufacturing process easier while ensuring reliable electrical connectivity through the melted solder
Solution Approach 2:
The standard lamination equipment and process perform the via formation function that would otherwise require specialized laser equipment. The lamination heater melts the pre-positioned solder elements to create conductive paths, allowing the manufacturing process to be simpler and more cost-effective while achieving the same electrical connectivity result
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the complexity and cost of producing printed circuit boards with buried vias by eliminating the need for multiple heating steps and specialized equipment, while improving connectivity and simplifying the manufacturing process, allowing for more efficient production of buried vias.
Implementation Method 1
the solder element having a melting point temperature within a temperature range of a curing temperature of the uncured dielectric material
Implementation Method 2
laminating the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material
Data Source
AI summary
A method may include forming a plurality of multilayer cores wherein each multilayer core comprises a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material, patterning each layer of metal in the plurality of multilayer cores to form wiring traces in each layer of metal, embedding a solder element in at least one sheet of a plurality of sheets of uncured dielectric material, wherein the solder element having a melting point temperature within a temperature range of a curing temperature of the uncured dielectric material, forming a printed circuit board by alternately stacking the plurality of multilayer cores with the plurality of sheets of uncured dielectric material between each multilayer core, laminating the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material and melting of the solder element.