A wiring board structure uses a laminated insulation resin layer and wiring layer to cover a cavity containing an electronic component.
A light-emitting element mounting package uses through wirings as thermal pathways to transfer heat from LEDs to a metallic radiator plate.
A composite metal foil structure uses a barrier layer and striping layer to prevent high temperature diffusion bonding and facilitate carrier layer peeling.
Sheet-like communication unit transmits signals through conductive layers and resistors, attenuating signal changes over distance.
Removing insulating films from via structures reduces manufacturing steps and production time while maintaining electrical connections between circuits.