Electrical Connection Printed Elements TRIZ Cases

A wiring board structure uses a laminated insulation resin layer and wiring layer to cover a cavity containing an electronic component.

A light-emitting element mounting package uses through wirings as thermal pathways to transfer heat from LEDs to a metallic radiator plate.

A composite metal foil structure uses a barrier layer and striping layer to prevent high temperature diffusion bonding and facilitate carrier layer peeling.

Sheet-like communication unit transmits signals through conductive layers and resistors, attenuating signal changes over distance.

Removing insulating films from via structures reduces manufacturing steps and production time while maintaining electrical connections between circuits.

Blind hole blocking shields the through-hole bottom to prevent via hole stubs, improving signal integrity in high-speed PCB designs.

Concave and convex aperture edges increase wiring coverage area to suppress disconnection risks while maintaining film thickness.

A multi-level package substrate integrates an antenna portion with transmission lines using a coaxial transition via for signal coupling.

A coreless substrate uses a carrier and embedded circuits to reduce thickness.

Mesh ground layers on the outer side and solid layers on the inner side of pleated curved portions prevent disconnection during repeated extension.

A flexible substrate uses bendable regions to overlap adjacent chip areas, reducing space occupation in display modules.

Laser resistant structures constrain machining depth to prevent over-trenching of underlying dielectric layers in circuit boards.

A differential transmission circuit uses a three-dimensional conductor crossing to suppress delay time differences.

Preformed undulations in flexible circuit boards enable swiveling motion for aircraft surveillance hinges.

A multilayer electrical node embeds components within a cavity-filled substrate to simplify assembly.

Stacked electrodes on substrates generate a lateral electric field to drive blue phase liquid crystal molecules.

Combines capacitance and ESD protection in one component to reduce mounting area while maintaining mechanical strength.

Anti-scratch coating protects fragile routing wires from scratches and shorting while maintaining electrical isolation.

An elastic blade spring deforms elastically to align motherboard connectors with varying hardware ports, eliminating forced connections and preventing damage.

A conductive circuit board uses laser etching to form patterned metal layers on substrate surfaces and via hole inner walls.

Etched insulation cavity eliminates exterior processing and carbonization to improve yield.

Inclining etching resist pieces relative to support sheet edges equalizes solution contact, resolving uneven etching that reduces positional accuracy.

A microelectronic assembly system uses a co-support structure with shared conductors to connect terminals across stacked components.

A method embeds solder elements in uncured dielectric sheets to form conductive paths during lamination.

A coreless printed circuit board embeds electronic components between insulating layers to reduce distance to semiconductor chips.

A printed wiring board uses a support plate to prevent warpage during semiconductor mounting.

Embedding pads in the insulating layer with a coplanar surface treatment reduces thickness while maintaining connection reliability.

A flexible stripline employs a radiation reduction conductor to suppress electromagnetic leakage and ensure precise mounting alignment on circuit boards.

A component carrier embeds a high-frequency component and integrates a waveguide within its laminated stack.

A hermetic feedthrough integrates a platinum conductive pathway within an alumina substrate to enable efficient electromagnetic interference filtering.

A directional coupler uses multilayer traces connected by vias to form an electrically large conductor.

A resin multilayer substrate design reduces thermal stress on joint portions using a second resin layer with a smaller linear expansion coefficient.

A PCB pad uses a buried stepped structure to prevent separation from the insulating layer.

A flexible wiring board design manages insulating layer thickness at substrate edges to protect conductive adhesive bumps from deformation stress.

Slits between via conductors segment ground patterns to block signal interference between voltage supply lines and reception paths.

Embedded conductive wires create a capacitive sensor in the substrate, resolving credential interception risks while lowering manufacturing complexity.

Adhesive elements in the display bending region combine circuit boards to distribute stress, reducing failure rates from process errors.

A magnetic composite inductor integrates inductors and capacitors into a single printed circuit board structure.

A printed circuit board dielectric layer incorporates carbon structures to conduct heat away from electronic components.

Segmented interposer sidewalls use partial conductive members to suppress electromagnetic interference while reducing manufacturing complexity.

Integrating interconnection formation into the bonding process reduces manufacturing time and cost for power electronics substrates.

Overlapping circuit substrates link wirings across layers, reducing non-display frame size while maintaining connectivity.

Laser ablation forms embedded circuit patterns in dielectric layers, eliminating costly over-plate and over-etch processes.

A low-frequency treatment device uses a wiring member extending through a pad through hole to connect body and pad side electrodes.

A nested SLIC connector architecture doubles I/O density by stacking wafers within a single mechanical envelope.

Pre-positioned adjacent components constrain vertical displacement of embedded parts during thermoplastic resin flow, ensuring reliable conductor connections.

Varying output pad widths compensate for thermal expansion, reducing misalignment between the tape carrier package and liquid crystal panel input pads.

Embedded inorganic oxide portions in the organic resin layer create gas escape paths and secure adhesion, preventing swelling from trapped volatile components.

A circuit board structure uses a raised first dielectric layer to isolate pads and support surface treatment.

Side surface plated apertures expand connectivity beyond major faces, reducing device volume while maintaining standard fabrication processes.