Composite Metal Foil Peeling via Barrier and Striping Layers
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Solution Overview
Problem
Conventional methods for preparing composite metal foils for Flexible Printed Circuit boards face challenges in preventing mutual diffusion between the carrier layer and the metal foil layer at high temperatures, leading to bonding issues that make it difficult to peel off the carrier layer from the metal foil layer.
Innovation Solution
A composite metal foil structure comprising a carrier layer, a barrier layer with a metal bonding layer and a high-temperature resistant layer, and a striping layer is introduced, where the striping layer is between the carrier layer and the metal foil layer, and the barrier layer is between the carrier layer and the metal foil layer, to prevent bonding and facilitate easy peeling, with specific materials and layer configurations to enhance peel strength and adhesion levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the composite metal foil and flexible insulating base film are press-fitted at high temperature, then the bonding strength between them is improved, but the carrier layer and metal foil layer diffuse mutually and bond together, making them difficult to peel off
Solution Approach 1:
The invention introduces a barrier layer as a separate component between the carrier layer and metal foil layer, dividing the original structure into distinct segments that prevent unwanted interactions while maintaining necessary functions
Solution Approach 2:
The barrier layer acts as an intermediary substance between the carrier layer and metal foil layer, preventing direct contact and mutual diffusion at high temperatures, thus solving the bonding problem while allowing easy peeling
2Device complexity
If a simple two-layer structure (carrier layer and metal foil layer) is used, then the device complexity is reduced, but the carrier layer and metal foil layer bond at high temperature, making peeling difficult
Solution Approach 1:
The barrier layer is strategically placed only where needed - between the carrier layer and metal foil layer - providing localized protection against diffusion without adding unnecessary complexity to the entire structure
Solution Approach 2:
The invention creates a composite structure with multiple functional layers (carrier layer, barrier layer, metal foil layer), where each layer has specific properties that collectively solve the peeling problem while maintaining overall structural simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution ensures that the carrier layer, barrier layer, and striping layer can be easily peeled off from the metal foil layer, preventing mutual diffusion and bonding, thereby maintaining the integrity and usability of the composite metal foil even at high temperatures.
Implementation Method 1
the barrier layer comprises a metal bonding layer and a high-temperature resistant layer stacked which are stacked, and the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer
Data Source
AI summary
A composite metal foil and a preparation method thereof are provided. The composite metal foil includes a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping layer, and the metal foil layer are sequentially stacked, the barrier layer includes a metal bonding layer and a high-temperature resistant layer stacked, and the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer. The striping layer is disposed between the carrier layer and the metal foil layer so as to facilitate peeling of the carrier layer, and the barrier layer is disposed between the carrier layer and the metal foil layer so as to prevent the carrier layer and the metal foil layer from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off. In addition, the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer, so that the barrier layer is not easy to separate from the carrier layer, and peeling between the barrier layer and the carrier layer is prevented.