Wiring Board with Built-in Component and Thin Wiring Layer
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Solution Overview
Problem
Wiring boards with built-in electronic components face challenges in maintaining mechanical strength and preventing warping due to thin thickness, especially in mobile devices, where reduced thickness leads to insufficient mechanical strength and potential cracking or warping issues.
Innovation Solution
A wiring board structure with a core substrate of 300 μm or less, featuring a cavity with an electronic component and a laminated structure comprising an insulation resin layer and a wiring layer, where the wiring layer is thinner than the electrode, and the laminated structure's thickness is set smaller than the core substrate, effectively preventing cracking and warping by managing thermal expansion coefficients and mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the wiring board thickness is reduced to meet miniaturization requirements, then the device can be made more compact, but the mechanical strength and rigidity become insufficient leading to cracking and warping
Solution Approach 1:
The patent employs a composite structure consisting of a core substrate and a laminated structure (insulation resin layer + wiring layer) with different material properties. The core substrate provides mechanical strength while the laminated structure provides electrical functionality and additional structural support, creating a composite material system that optimizes both thickness and strength.
Solution Approach 2:
The wiring board is divided into distinct functional segments: the core substrate (providing mechanical support), the insulation resin layer (providing electrical isolation), and the wiring layer (providing electrical connections). This segmentation allows each layer to be optimized for its specific function while contributing to overall structural integrity.
2Volume of moving object
If the wiring board thickness is reduced, then the device becomes more compact, but warping occurs due to insufficient rigidity
Solution Approach 1:
The laminated structure combines insulation resin with wiring layers to create a composite material system where the wiring layer reinforces the insulation resin, preventing warping. The differential thermal expansion coefficients between layers are managed through this composite structure, maintaining dimensional stability.
Solution Approach 2:
The patent applies local quality by making the wiring layer thickness variable - thinner than the electrode thickness in specific regions to accommodate the electronic component while maintaining sufficient rigidity in other areas. This localized optimization prevents warping without compromising the compact design.
3Volume of moving object
If the wiring layer thickness is made smaller than electrode thickness, then the overall structure becomes thinner, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies that the wiring layer thickness should be smaller than the electrode thickness but provides a minimum thickness requirement (5 μm or more) to ensure manufacturability. This parameter change approach allows optimization of overall thickness while establishing clear manufacturing guidelines.
Data Source
AI summary
A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 μm and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 μm and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including an insulation resin layer and a wiring layer such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component accommodated in the cavity of the core substrate. The electronic component has an insulation material body and an electrode formed on a surface of the insulation material body, and the wiring layer of the laminated structure is formed such that the thickness of the wiring layer is set smaller than the thickness of the electrode.